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ISO7721BDW

Texas Instruments

ISO7721BDW by Texas Instruments

ISO7721BDW by Texas Instruments is a 16-terminal interface IC with CMOS technology. It operates b/w -55 to 125°C, suitable for military-grade applications. With a supply voltage range of 2.25-5.5V, it features dual terminals and Gull Wing form factor for surface mount assembly.

Median Price

$2.258

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 3,519 parts In-Stock

1+ parts

$2.258

100+ parts

$1.865

1k+ parts

$1.008

10k+ parts

-

3,519

$2.258

$1.865

$1.008

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$1.512

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$1.512

-

-

-

Digiode

USA . 4,026 parts In-Stock

1+ parts

$2.145

100+ parts

-

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-

10k+ parts

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4,026

$2.145

-

-

-

Vyrian

USA . 3,497 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,497

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aranea Global

USA . 100 parts In-Stock

1+ parts

$1.482

100+ parts

-

1k+ parts

$1.422

10k+ parts

-

100

$1.482

-

$1.422

-

Continental Prestige Electronics

USA . 3,159 parts In-Stock

1+ parts

$1.512

100+ parts

-

1k+ parts

-

10k+ parts

$1.482

3,159

$1.512

-

-

$1.482

Argo Parts USA

USA . 1,078 parts In-Stock

1+ parts

$1.512

100+ parts

-

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-

10k+ parts

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1,078

$1.512

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-

-

Ampacity Inc.

Singapore . 3,272 parts In-Stock

1+ parts

$1.920

100+ parts

-

1k+ parts

-

10k+ parts

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3,272

$1.920

-

-

-

Parana Technologies

USA . 1,299 parts In-Stock

1+ parts

$2.022

100+ parts

-

1k+ parts

$2.546

10k+ parts

-

1,299

$2.022

-

$2.546

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Corphita

USA . 3,348 parts In-Stock

1+ parts

$2.032

100+ parts

-

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10k+ parts

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3,348

$2.032

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-

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ChromeModa Solutions

Germany . 6,975 parts In-Stock

1+ parts

$2.272

100+ parts

$1.863

1k+ parts

-

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6,975

$2.272

$1.863

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IDEA Electronic Components Group

UK . 1,284 parts In-Stock

1+ parts

$2.272

100+ parts

-

1k+ parts

$2.045

10k+ parts

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1,284

$2.272

-

$2.045

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Semicontronic

India . 3,187 parts In-Stock

1+ parts

$4.180

100+ parts

$4.076

1k+ parts

$4.055

10k+ parts

-

3,187

$4.180

$4.076

$4.055

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Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$10.998

100+ parts

$10.448

1k+ parts

$10.448

10k+ parts

-

200

$10.998

$10.448

$10.448

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Corohmni

South Africa . 513 parts In-Stock

1+ parts

$14.869

100+ parts

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513

$14.869

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AZTECH Wire

Italy . 142 parts In-Stock

1+ parts

$21.740

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142

$21.740

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DigiPath Technology Company

USA . 1,067 parts In-Stock

1+ parts

-

100+ parts

$2.048

1k+ parts

-

10k+ parts

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1,067

-

$2.048

-

-

Robosynatics

Brazil . 150 parts In-Stock

1+ parts

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100+ parts

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150

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Lucentia Tech

USA . 150 parts In-Stock

1+ parts

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100+ parts

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150

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Overview

Elevate your electronic designs with the Texas Instruments ISO7721BDW Interface IC. From a trusted manufacturer known for quality and reliability, this small outline package offers dual-channel functionality and operates at military-grade temperatures. Perfect for a wide range of applications, this interface circuit provides seamless communication between components while ensuring the utmost safety and efficiency. Upgrade your projects with the Texas Instruments ISO7721BDW and experience the benefits of superior performance and peace of mind in every use.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is known for its durability and resistance to heat, making this product suitable for a wide range of operating temperatures.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and effort during manufacturing.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, this IC can be used in a variety of applications without the risk of damage due to overvoltage.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient and fits well on PCBs, optimizing layout design for compact electronic devices.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and longevity of the IC.

Temperature Grade: MILITARY

Being rated for military-grade temperatures, this IC can withstand extreme environmental conditions, making it suitable for rugged applications.

No. of Channels: 2

Having 2 channels allows for versatile interfacing capabilities, enabling multiple functions or devices to communicate simultaneously.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the IC in various applications.

Nominal Supply Voltage: 3.3 V

Having a standard nominal supply voltage of 3.3V ensures compatibility with common power sources, making integration easier and more straightforward.

Technical Specifications

Other Function Interface ICs ISO7721BDW attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.25 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

ISO7721BDW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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