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HPC3130APGEG4

Texas Instruments

HPC3130APGEG4 by Texas Instruments

HPC3130APGEG4 by Texas Instruments is a Bus Controller with 144 terminals, operating at temperatures from 0 to 70°C. It features power supplies of 3.3V and 3.3/5V, with a package style of FLATPACK for surface mounting applications in commercial-grade technology environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,828 parts In-Stock

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Vyrian

USA . 4,767 parts In-Stock

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4,767

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Distributors (Availability)

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AZTECH Wire

Italy . 320 parts In-Stock

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$9.340

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320

$9.340

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One Stop Electronics

USA . 1,335 parts In-Stock

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$30.000

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$30.000

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Corohmni

South Africa . 480 parts In-Stock

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$41.794

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480

$41.794

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Parana Technologies

USA . 1,851 parts In-Stock

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$46.869

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$46.869

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IDEA Electronic Components Group

UK . 2,275 parts In-Stock

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$52.662

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$50.029

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$47.396

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2,275

$52.662

$50.029

$47.396

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ChromeModa Solutions

Germany . 1,081 parts In-Stock

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$52.662

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$43.183

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1,081

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$43.183

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Corphita

USA . 2,735 parts In-Stock

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DigiPath Technology Company

USA . 403 parts In-Stock

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$47.480

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403

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Microchip USA

USA . 268 parts In-Stock

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Overview

Elevate your electronic designs with the HPC3130APGEG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-notch quality and reliability. This bus controller is versatile and can be used across various applications, making it a valuable addition to any project. With its innovative technology and high-performance features, customers can expect seamless operation and enhanced functionality. Trust Texas Instruments to deliver excellence in every product, including the HPC3130APGEG4.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the bus controller.

Surface Mount: YES

Being surface mountable makes the bus controller easy to install and allows for compact and space-saving design in electronic devices.

Package Shape: SQUARE

The square package shape allows for efficient use of board space and facilitates a streamlined layout for the bus controller within electronic systems.

Power Supplies (V): 3.3, 3.3/5

The availability of multiple power supply options (3.3V and 3.3/5V) provides flexibility in compatibility with various devices and systems.

No. of Terminals: 144

With 144 terminals, this bus controller offers a wide range of connectivity options, allowing for versatile integration with other components.

Package Style (Meter): FLATPACK

The flatpack package style enables easy handling, installation, and removal of the bus controller, making it convenient for assembly and maintenance.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70°C ensures reliable performance even in challenging thermal conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C indicates the bus controller's ability to function effectively in varied environmental settings.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent conductivity, corrosion resistance, and solderability for reliable connections and long-term durability.

Terminal Position: QUAD

The quad terminal position provides stability and secure attachment on the circuit board, enhancing the overall reliability of the bus controller.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature of 30 seconds minimizes the risk of overheating during assembly, ensuring the integrity of the bus controller.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260°C indicates the bus controller's capability to withstand rigorous soldering processes without damage.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures consistent performance and stability of the bus controller in standard operating environments.

Technology: CMOS

The CMOS technology used in the bus controller offers low power consumption, high speed, and enhanced noise immunity, contributing to efficient and reliable operation.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and ease of soldering, making it a robust and user-friendly option for connecting the bus controller.

Terminal Pitch: 0.5 mm

The compact terminal pitch of 0.5 mm allows for dense packing of terminals on the bus controller, enabling a high level of connectivity in a limited space.

Moisture Sensitivity Level (MSL): 2

With a moisture sensitivity level of 2, the bus controller can withstand moderate exposure to humidity during storage and assembly processes without impacting its performance.

Technical Specifications

Bus Controllers HPC3130APGEG4 attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

144

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,3.3/5

Qualification:

Not Qualified

Sub-Category:

Bus Controllers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

HPC3130APGEG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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