Loading...

HPC3130APBM

Texas Instruments

HPC3130APBM by Texas Instruments

HPC3130APBM by Texas Instruments is a Bus Controller with 120 terminals, operating at 66.66 MHz clock frequency. It has an address bus width of 5 bits and supports external data bus width of 8 bits. Ideal for PCI applications due to its GULL WING terminal form and CMOS technology.

Median Price

$17.087

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 3,033 parts In-Stock

1+ parts

-

100+ parts

$13.670

1k+ parts

$12.230

10k+ parts

$11.510

3,033

-

$13.670

$12.230

$11.510

DigiKey

USA . 3,033 parts In-Stock

1+ parts

-

100+ parts

$17.990

1k+ parts

-

10k+ parts

-

3,033

-

$17.990

-

-

Verical

USA . 2,529 parts In-Stock

1+ parts

-

100+ parts

$17.087

1k+ parts

$15.287

10k+ parts

-

2,529

-

$17.087

$15.287

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,970 parts In-Stock

1+ parts

$14.440

100+ parts

-

1k+ parts

-

10k+ parts

-

3,970

$14.440

-

-

-

Vyrian

USA . 4,897 parts In-Stock

1+ parts

$15.200

100+ parts

-

1k+ parts

-

10k+ parts

-

4,897

$15.200

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,270 parts In-Stock

1+ parts

$13.680

100+ parts

-

1k+ parts

-

10k+ parts

-

1,270

$13.680

-

-

-

Parana Technologies

USA . 236 parts In-Stock

1+ parts

$14.599

100+ parts

-

1k+ parts

$15.039

10k+ parts

-

236

$14.599

-

$15.039

-

DigiPath Technology Company

USA . 1,662 parts In-Stock

1+ parts

$16.075

100+ parts

$14.789

1k+ parts

-

10k+ parts

-

1,662

$16.075

$14.789

-

-

IDEA Electronic Components Group

UK . 1,320 parts In-Stock

1+ parts

$16.403

100+ parts

$15.583

1k+ parts

$14.763

10k+ parts

-

1,320

$16.403

$15.583

$14.763

-

ChromeModa Solutions

Germany . 38 parts In-Stock

1+ parts

$16.403

100+ parts

$13.450

1k+ parts

-

10k+ parts

-

38

$16.403

$13.450

-

-

Microchip USA

USA . 388 parts In-Stock

1+ parts

$44.270

100+ parts

$43.640

1k+ parts

$43.320

10k+ parts

$43.000

388

$44.270

$43.640

$43.320

$43.000

Corohmni

South Africa . 39 parts In-Stock

1+ parts

$82.364

100+ parts

-

1k+ parts

-

10k+ parts

-

39

$82.364

-

-

-

Overview

Unlock the power of seamless data connectivity with the HPC3130APBM by Texas Instruments. Crafted with precision and expertise, this bus controller offers unparalleled reliability and performance. From enhancing system efficiency to maximizing data transfer speeds, this versatile device is a game-changer in various applications. Elevate your projects with the trusted quality of Texas Instruments and experience the next level of innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the bus controller.

Maximum Supply Voltage: 3.6 V

Allows for a higher supply voltage input which can handle power fluctuations without causing damage to the controller.

Address Bus Width: 5

Allows for efficient data transfer and communication between different components in the system.

Maximum Clock Frequency: 66.66 MHz

High clock frequency enables fast data processing and ensures smooth operation of the bus controller.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the bus controller energy-efficient and reliable.

Technical Specifications

Bus Controllers HPC3130APBM attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

5

Maximum Clock Frequency:

66.66 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G120

Length:

28 mm

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

120

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP120,1.2SQ,32

Package Shape:

Package Style (Meter):

FLATPACK

Power Supplies (V):

3.3,3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

4.1 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Width:

28 mm

Peripheral IC Type:

Trade Compliance

HPC3130APBM Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

New products
from Texas Instruments 7

Similar products 7