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HPC3130PGE

Texas Instruments

HPC3130PGE by Texas Instruments

HPC3130PGE by Texas Instruments is a Bus Controller with 144 terminals, operating at 66.66 MHz clock frequency. It has an 8-bit external data bus width and supports PCI technology for commercial-grade applications. The package style is flatpack with low profile and fine pitch, suitable for surface mount assembly in various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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Vyrian

USA . 9,649 parts In-Stock

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Digiode

USA . 1,474 parts In-Stock

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Connector Distribution Corp

USA . 159 parts In-Stock

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Right Parts Inc.

USA . 159 parts In-Stock

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AZTECH Wire

Italy . 424 parts In-Stock

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$8.143

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One Stop Electronics

USA . 1,268 parts In-Stock

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$26.000

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Corohmni

South Africa . 866 parts In-Stock

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Parana Technologies

USA . 1,142 parts In-Stock

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$64.481

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$5,988.075

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$58.033

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DigiPath Technology Company

USA . 1,172 parts In-Stock

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$71.002

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ChromeModa Solutions

Germany . 6,531 parts In-Stock

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$72.451

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$59.410

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IDEA Electronic Components Group

UK . 384 parts In-Stock

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$72.451

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$68.828

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$65.206

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Corphita

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Overview

Looking for a reliable and high-quality bus controller? Look no further than the HPC3130PGE by Texas Instruments. With its durable plastic/epoxy package body material and surface mount capabilities, this product offers exceptional performance in various applications. From data processing to communication systems, this bus controller provides seamless integration and efficient operation. Experience the value and benefits of Texas Instruments' superior technology with the HPC3130PGE, delivering reliable power supplies, wide address bus width, and maximum clock frequency for optimal performance. Elevate your projects with this top-of-the-line bus controller today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and lightweight design, making it ideal for portable or compact applications.

Surface Mount: YES

The ability for surface mounting allows for easy and efficient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage ensures compatibility with a wide range of power sources, providing flexibility in design and operation.

Address Bus Width: 5

A wider address bus width allows for more memory locations to be accessed, enhancing the overall performance and capabilities of the bus controller.

Package Shape: SQUARE

The square package shape enables efficient use of space on the circuit board, optimizing layout and allowing for compact designs.

Power Supplies (V): 3.3,3.3/5

The availability of multiple power supply options ensures compatibility with various systems and power sources, making it versatile and widely applicable.

No. of Terminals: 144

The high number of terminals allows for connectivity to multiple components and peripherals, enabling a more versatile and integrated system.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The combination of flatpack, low profile, and fine pitch package styles offers versatility in mounting options, making it suitable for various design requirements.

Minimum Supply Voltage: 3 V

The low minimum supply voltage ensures efficient power usage and compatibility with lower power sources, improving energy efficiency.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature range allows for reliable performance in a variety of environmental conditions, ensuring durability and stability.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures the bus controller can function reliably in cooler environments, adding to its versatility.

Terminal Position: QUAD

The quad terminal position provides a secure and stable connection, reducing the risk of disconnection or signal interference for improved performance.

Maximum Seated Height: 1.6 mm

The low maximum seated height allows for a compact and space-efficient design, making it suitable for applications where size constraints are a consideration.

Width: 20 mm

The compact width of 20mm allows for easy integration into a variety of systems and devices, providing flexibility in installation and layout.

External Data Bus Width: 8

The wider external data bus width of 8 allows for faster data transfer and processing speeds, enhancing the overall performance of the bus controller.

Maximum Clock Frequency: 66.66 MHz

The high maximum clock frequency of 66.66 MHz enables fast data processing and communication, improving overall system efficiency and performance.

Length: 20 mm

The compact length of 20mm allows for efficient use of space in the system design, making it suitable for compact or portable applications.

Temperature Grade: COMMERCIAL

The commercial temperature grade ensures reliable operation in standard temperature conditions, making it suitable for a wide range of commercial applications.

Peripheral IC Type: BUS CONTROLLER, PCI

The inclusion of bus controller and PCI peripheral IC types provides versatile connectivity options and compatibility with various devices and systems.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, enhancing efficiency and reliability in operation.

Terminal Form: GULL WING

The gull wing terminal form provides a secure and reliable connection, minimizing the risk of signal interference or disconnection for improved performance.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures stable and consistent power supply, contributing to reliable operation and performance.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5mm allows for precise and secure connections, ensuring reliable signal transmission and reducing the risk of signal interference.

Technical Specifications

Bus Controllers HPC3130PGE attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 5V SUPPLY

Address Bus Width:

5

Maximum Clock Frequency:

66.66 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

No. of Terminals:

144

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3,3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

20 mm

Peripheral IC Type:

Trade Compliance

HPC3130PGE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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