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HPC3130APGE

Texas Instruments

HPC3130APGE by Texas Instruments

HPC3130APGE by Texas Instruments is a bus controller with 144 terminals, operating at 3.3V and supporting an 8-bit external data bus width. It has a max clock frequency of 66.66 MHz and is ideal for PCI applications in commercial temperature grades.

Median Price

$19.720

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 710 parts In-Stock

1+ parts

-

100+ parts

$17.060

1k+ parts

$15.270

10k+ parts

$14.370

710

-

$17.060

$15.270

$14.370

DigiKey

USA . 710 parts In-Stock

1+ parts

-

100+ parts

$19.720

1k+ parts

-

10k+ parts

-

710

-

$19.720

-

-

Verical

USA . 710 parts In-Stock

1+ parts

-

100+ parts

$21.325

1k+ parts

$19.087

10k+ parts

$17.962

710

-

$21.325

$19.087

$17.962

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,959 parts In-Stock

1+ parts

$18.012

100+ parts

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4,959

$18.012

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Vyrian

USA . 6,188 parts In-Stock

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6,188

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Semi Source

USA . 1,126 parts In-Stock

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1,126

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DigiKey Marketplace

USA . 710 parts In-Stock

1+ parts

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710

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Bristol Electronics

USA . 599 parts In-Stock

1+ parts

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599

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Atlantic Semiconductor

USA . 599 parts In-Stock

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599

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LWI Electronics Inc

India . 10 parts In-Stock

1+ parts

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 444 parts In-Stock

1+ parts

$17.064

100+ parts

-

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444

$17.064

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Parana Technologies

USA . 2,150 parts In-Stock

1+ parts

$71.190

100+ parts

-

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2,150

$71.190

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Corohmni

South Africa . 237 parts In-Stock

1+ parts

$76.942

100+ parts

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237

$76.942

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DigiPath Technology Company

USA . 1,651 parts In-Stock

1+ parts

$78.389

100+ parts

$72.118

1k+ parts

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10k+ parts

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1,651

$78.389

$72.118

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ChromeModa Solutions

Germany . 3,858 parts In-Stock

1+ parts

$79.989

100+ parts

$65.591

1k+ parts

-

10k+ parts

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3,858

$79.989

$65.591

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IDEA Electronic Components Group

UK . 924 parts In-Stock

1+ parts

$79.989

100+ parts

$75.990

1k+ parts

$71.990

10k+ parts

-

924

$79.989

$75.990

$71.990

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Kepictronics

USA . 1,650 parts In-Stock

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1,650

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Microchip USA

USA . 251 parts In-Stock

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251

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Overview

Unlock the full potential of your electronics with the HPC3130APGE by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments ensures top-notch quality and reliability in their products. Designed for bus controllers, this versatile device is perfect for a wide range of applications. With its high-performance capabilities and innovative features, the HPC3130APGE offers exceptional value to customers looking for efficient and seamless integration. Upgrade your technology today with Texas Instruments and experience the difference firsthand.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the bus controller easy to handle and resistant to damage during handling and operation.

Surface Mount: YES

Surface mount technology allows for easy and efficient integration into PCBs, saving space and reducing assembly costs.

Maximum Supply Voltage: 3.6 V

The bus controller can operate efficiently within a wide range of supply voltages, providing flexibility in system design.

Address Bus Width: 5

A wider address bus allows for increased data transfer capabilities and efficient communication between components in the system.

Power Supplies (V): 3.3,3.3/5

Multiple power supply options ensure compatibility with various system configurations and voltage requirements.

No. of Terminals: 144

A higher number of terminals enables the bus controller to connect to multiple devices simultaneously, enhancing system functionality.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

The compact and low-profile package design allows for efficient use of space on the PCB, especially in tight layouts and high-density designs.

Maximum Operating Temperature: 70 °C

The bus controller can operate at high temperatures without any performance degradation, ensuring reliability in a variety of environments.

Minimum Operating Temperature: 0 °C

The bus controller can operate in low-temperature conditions, making it suitable for use in a wide range of applications and environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance, ensuring reliable connections and durability of the terminals.

External Data Bus Width: 8

A wider external data bus enables faster data transfer rates and improved system performance by allowing more data to be transmitted simultaneously.

Maximum Clock Frequency: 66.66 MHz

The high clock frequency allows for quick data processing and communication, making the bus controller suitable for high-speed applications.

Technical Specifications

Bus Controllers HPC3130APGE attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Address Bus Width:

5

Maximum Clock Frequency:

66.66 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e4

Length:

20 mm

Moisture Sensitivity Level (MSL):

2

No. of Terminals:

144

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP144,.87SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Trade Compliance

HPC3130APGE Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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