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HPC3130PBK

Texas Instruments

HPC3130PBK by Texas Instruments

HPC3130PBK by Texas Instruments is a Bus Controller with 128 terminals, operating at 66.66 MHz clock frequency and supporting 3.3V power supplies. It has an address bus width of 5, external data bus width of 8, and is ideal for PCI applications due to its CMOS technology and quad terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,493 parts In-Stock

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Digiode

USA . 2,432 parts In-Stock

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2,432

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LIBRA Elektronik GmbH

Germany . 264 parts In-Stock

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LWI Electronics Inc

India . 5 parts In-Stock

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One Stop Electronics

USA . 1,640 parts In-Stock

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$7.000

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$7.000

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AZTECH Wire

Italy . 647 parts In-Stock

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$16.056

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Parana Technologies

USA . 2,334 parts In-Stock

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$35.483

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$3,295.090

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$31.934

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2,334

$35.483

$3,295.090

$31.934

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DigiPath Technology Company

USA . 971 parts In-Stock

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$39.071

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971

$39.071

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ChromeModa Solutions

Germany . 6,037 parts In-Stock

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$39.868

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$32.692

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IDEA Electronic Components Group

UK . 390 parts In-Stock

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$39.868

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$37.875

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$35.881

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390

$39.868

$37.875

$35.881

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Corohmni

South Africa . 5,214 parts In-Stock

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$75.579

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A-Z Elektronik GmbH

Germany . 5,376 parts In-Stock

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Corphita

USA . 4,019 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,584 parts In-Stock

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Authorized Procurement Solutions

USA . 2,800 parts In-Stock

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Kepictronics

USA . 333 parts In-Stock

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Overview

Enhance your electronic designs with the innovative HPC3130PBK Bus Controller by Texas Instruments. Crafted with precision and reliability, this product offers unmatched quality and performance for a wide range of applications. Whether you're working on PCI peripherals or bus controllers, this device is designed to deliver seamless operation and efficiency. With its advanced technology and durable construction, the HPC3130PBK ensures optimal functionality and longevity. Elevate your projects with this exceptional solution from a trusted manufacturer, Texas Instruments. Choose excellence, choose the HPC3130PBK.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation of the bus controller onto a circuit board.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage capability ensures compatibility with a wide range of power sources.

Address Bus Width: 5

The address bus width of 5 allows for efficient communication and data transfer within the system.

Package Shape: SQUARE

The square package shape provides a compact design, saving space on the circuit board.

Power Supplies (V): 3.3, 3.3/5

The flexibility in power supply options allows for versatile integration with different systems and power configurations.

No. of Terminals: 128

With a high number of terminals, the bus controller can support multiple connections and interfaces.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The combination of flatpack, low profile, and fine pitch package styles offers versatility and compatibility with various assembly processes.

Minimum Supply Voltage: 3 V

The low minimum supply voltage requirement ensures efficient power usage and extends the product's lifespan.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature tolerance makes the bus controller suitable for use in industrial environments with varying temperature conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature tolerance ensures reliable performance even in colder environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides corrosion resistance and ensures longevity of the connections.

Terminal Position: QUAD

The quad terminal position allows for easy alignment and installation onto the circuit board.

Maximum Seated Height: 1.6 mm

The low maximum seated height helps in maintaining a compact and slim profile of the overall system.

Width: 14 mm

The moderate width of 14 mm allows for efficient placement and integration within the circuit board layout.

External Data Bus Width: 8

The wide external data bus width of 8 enhances the data processing capabilities of the bus controller.

Maximum Clock Frequency: 66.66 MHz

The high maximum clock frequency enables fast data transfer and processing speeds within the system.

Maximum Time At Peak Reflow Temperature (s): 30

The short maximum time at peak reflow temperature ensures quick and efficient soldering during the assembly process.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures reliable and secure solder joints during the manufacturing process.

Length: 14 mm

The moderate length of 14 mm complements the width and seated height specifications, providing a well-balanced form factor.

Temperature Grade: COMMERCIAL

The commercial temperature grade makes the bus controller suitable for standard operating conditions in commercial applications.

Peripheral IC Type: BUS CONTROLLER, PCI

The specific peripheral IC type indicates that the bus controller is designed for handling bus communication protocols such as PCI, making it a reliable choice for interfacing with different devices.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, enhancing the overall performance and efficiency of the bus controller.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical strength and stability during installation and operation.

Nominal Supply Voltage: 3.3 V

The consistent nominal supply voltage of 3.3 V ensures stable and reliable operation of the bus controller.

Terminal Pitch: 0.4 mm

The fine terminal pitch of 0.4 mm allows for high-density mounting and ensures accurate alignment during the assembly process.

Technical Specifications

Bus Controllers HPC3130PBK attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

Additional Features:

ALSO REQUIRES 5V SUPPLY

Address Bus Width:

5

Maximum Clock Frequency:

66.66 MHz

External Data Bus Width:

8

JESD-30 Code:

S-PQFP-G128

JESD-609 Code:

e4

Length:

14 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

128

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP128,.64SQ,16

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,3.3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.6 mm

Sub-Category:

Bus Controllers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

HPC3130PBK Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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