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HPC3130APBKG4

Texas Instruments

HPC3130APBKG4 by Texas Instruments

HPC3130APBKG4 by Texas Instruments is a Bus Controller with 128 terminals, operating at 3.3V and 5V. It features a flatpack style package, CMOS technology, and can withstand temperatures from 0 to 70°C. Ideal for commercial applications requiring precise power management in compact electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,640 parts In-Stock

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7,640

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Digiode

USA . 818 parts In-Stock

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818

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 543 parts In-Stock

1+ parts

$14.262

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543

$14.262

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Corohmni

South Africa . 2,944 parts In-Stock

1+ parts

$20.170

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2,944

$20.170

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One Stop Electronics

USA . 217 parts In-Stock

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$22.000

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217

$22.000

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Parana Technologies

USA . 428 parts In-Stock

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$68.141

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428

$68.141

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IDEA Electronic Components Group

UK . 387 parts In-Stock

1+ parts

$76.563

100+ parts

$72.735

1k+ parts

$68.907

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387

$76.563

$72.735

$68.907

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ChromeModa Solutions

Germany . 122 parts In-Stock

1+ parts

$76.563

100+ parts

$62.782

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122

$76.563

$62.782

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Corphita

USA . 4,981 parts In-Stock

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4,981

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DigiPath Technology Company

USA . 1,682 parts In-Stock

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$69.029

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1,682

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$69.029

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Overview

Unlock the potential of your electronic devices with the high-quality HPC3130APBKG4 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers reliable bus controllers that offer seamless integration and superior performance. This versatile product is perfect for a wide range of applications, providing customers with unmatched value, benefits, and advantages. Upgrade your electronics today and experience the difference with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product less prone to damage during transportation and installation.

Surface Mount: YES

Surface mount technology allows for more efficient and compact placement of the bus controller on a circuit board.

Package Shape: SQUARE

Square packages are space-efficient and can help optimize the layout of components on a circuit board.

Power Supplies (V): 3.3,3.3/5

Support for multiple power supply voltages allows for flexibility in usage scenarios and compatibility with various systems.

No. of Terminals: 128

Having a high number of terminals enables the bus controller to interface with multiple devices and components efficiently.

Package Style (Meter): FLATPACK

Flatpack packages offer a low profile design, saving space on the circuit board and facilitating better airflow for cooling.

Maximum Operating Temperature: 70 °C

A high maximum operating temperature ensures reliable performance even under demanding environmental conditions.

Minimum Operating Temperature: 0 °C

The ability to operate at low temperatures makes the bus controller suitable for use in a wide range of environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This terminal finish provides excellent conductivity and corrosion resistance, ensuring long-term reliability of connections.

Terminal Position: QUAD

Quad terminal positions offer enhanced stability and mechanical strength, reducing the risk of connection failures.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time required for this product's assembly process helps minimize thermal stress on components and ensures consistent quality.

Peak Reflow Temperature °C: 260

The high peak reflow temperature capability allows for reliable solder joints and effective bonding during the manufacturing process.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that the bus controller is suitable for standard operating conditions commonly found in commercial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the efficiency and reliability of the bus controller.

Terminal Form: GULL WING

Gull wing terminal forms provide mechanical stability and ease of soldering, ensuring secure connections and efficient assembly.

Terminal Pitch: 0.4 mm

The narrow terminal pitch allows for closer spacing of terminals, enabling higher density integration and improved signal integrity.

Technical Specifications

Bus Controllers HPC3130APBKG4 attributes and parameters. Explore more Bus Controllers devices from Texas Instruments

Specs

JESD-30 Code:

S-PQFP-G128

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

128

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

QFP

Package Equivalence Code:

QFP128,.64SQ,16

Package Shape:

Package Style (Meter):

FLATPACK

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3,3.3/5

Qualification:

Not Qualified

Sub-Category:

Bus Controllers

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

HPC3130APBKG4 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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