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HPA02254YZFR

Texas Instruments

HPA02254YZFR by Texas Instruments

Texas Instruments' HPA02254YZFR is a Power Management IC with 15 terminals, operating b/w -40 to 85°C. It features a nominal voltage of 3.6V and supports a min supply voltage of 2.8V, making it ideal for industrial applications requiring precise power supply management in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,651 parts In-Stock

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2,651

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Vyrian

USA . 2,273 parts In-Stock

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2,273

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Distributors (Availability)

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Semicontronic

India . 894 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

10k+ parts

-

894

$0.500

$0.488

$0.485

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One Stop Electronics

USA . 375 parts In-Stock

1+ parts

$4.500

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-

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375

$4.500

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AZTECH Wire

Italy . 585 parts In-Stock

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$8.306

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585

$8.306

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Parana Technologies

USA . 1,276 parts In-Stock

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$19.943

100+ parts

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$19.890

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1,276

$19.943

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$19.890

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DigiPath Technology Company

USA . 1,093 parts In-Stock

1+ parts

$21.960

100+ parts

$20.203

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1,093

$21.960

$20.203

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ChromeModa Solutions

Germany . 5,861 parts In-Stock

1+ parts

$22.408

100+ parts

$18.375

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5,861

$22.408

$18.375

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IDEA Electronic Components Group

UK . 2,156 parts In-Stock

1+ parts

$22.408

100+ parts

$21.288

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$20.167

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2,156

$22.408

$21.288

$20.167

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QUARKTWIN TECHNOLOGY LTD

USA . 29,803 parts In-Stock

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Lixinc

USA . 17,607 parts In-Stock

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Metaverse IC Inc.

Canada . 5,160 parts In-Stock

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Microchip USA

USA . 3,375 parts In-Stock

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Corphita

USA . 2,919 parts In-Stock

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Authorized Procurement Solutions

USA . 2,700 parts In-Stock

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2,700

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Corohmni

South Africa . 462 parts In-Stock

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462

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iodParts Technologies Inc.

India . 237 parts In-Stock

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237

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Overview

Elevate your power management solutions with the HPA02254YZFR by Texas Instruments. This cutting-edge IC boasts top-notch quality and reliability, courtesy of its renowned manufacturer. Ideal for a variety of applications, this power management IC promises seamless integration and optimal performance. Experience the value and benefits that this product brings to the table, offering customers unmatched advantages in power supply management. Upgrade your systems with the HPA02254YZFR and witness the difference for yourself.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient installation on PCBs, saving time and space.

Nominal Supply Voltage (Vsup): 3.6 V

Ideal voltage range for many power management applications, ensuring compatibility.

Package Style: GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Compact package style with fine pitch terminals, enabling high-density board designs.

Maximum Operating Temperature: 85 °C

Can operate reliably at high temperatures, suitable for industrial environments.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for operation in harsh conditions.

Terminal Finish: Tin/Silver/Copper (Sn/Ag/Cu)

High-quality terminal finish for good conductivity and reliability.

Technical Specifications

Power Management ICs HPA02254YZFR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Additional Features:

ALSO OPERATES WITH SUPPLY VOLTAGE 2.45 TO 2.8V

Adjustable Threshold:

NO

JESD-30 Code:

R-XBGA-B15

JESD-609 Code:

e1

Length:

2.61 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

15

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

2.8 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Silver/Copper (Sn/Ag/Cu)

Terminal Form:

BALL

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

1.956 mm

Trade Compliance

HPA02254YZFR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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