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HPA02149AIYFFR

Texas Instruments

HPA02149AIYFFR by Texas Instruments

Texas Instruments HPA02149AIYFFR is a Power Management IC with 12 terminals, 3.3V nominal voltage, and -40 to 125°C operating temperature range. Ideal for automotive applications due to its very thin profile grid array package style and low supply current of 0.42mA.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,862 parts In-Stock

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Digiode

USA . 371 parts In-Stock

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371

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Semicontronic

India . 1,598 parts In-Stock

1+ parts

$0.500

100+ parts

$0.488

1k+ parts

$0.485

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1,598

$0.500

$0.488

$0.485

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One Stop Electronics

USA . 1,227 parts In-Stock

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$0.500

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$0.500

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Ampacity Inc.

Singapore . 1,433 parts In-Stock

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$2.500

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1,433

$2.500

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Parana Technologies

USA . 561 parts In-Stock

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$5.478

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$6.209

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561

$5.478

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$6.209

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DigiPath Technology Company

USA . 209 parts In-Stock

1+ parts

$6.032

100+ parts

$5.549

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209

$6.032

$5.549

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ChromeModa Solutions

Germany . 4,409 parts In-Stock

1+ parts

$6.155

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$5.047

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4,409

$6.155

$5.047

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IDEA Electronic Components Group

UK . 328 parts In-Stock

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$6.155

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$5.540

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328

$6.155

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$5.540

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AZTECH Wire

Italy . 222 parts In-Stock

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$6.992

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222

$6.992

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Metaverse IC Inc.

Canada . 18,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 7,195 parts In-Stock

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Microchip USA

USA . 2,842 parts In-Stock

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Corphita

USA . 1,770 parts In-Stock

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Perfect Parts

USA . 504 parts In-Stock

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504

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Corohmni

South Africa . 135 parts In-Stock

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Overview

Elevate your power management game with the HPA02149AIYFFR by Texas Instruments. This sleek and compact GRID ARRAY IC offers unparalleled performance and reliability, making it the perfect choice for a wide range of applications in the automotive industry. With a nominal supply voltage of 3.3V and a maximum operating temperature of 125°C, this POWER SUPPLY MANAGEMENT CIRCUIT delivers top-notch efficiency and precision. Trust Texas Instruments to provide cutting-edge technology that exceeds expectations, ensuring optimal performance every time. Experience the difference with the HPA02149AIYFFR - where quality meets innovation.

Feature Benefit Bullets

Surface Mount: YES

Surface mount packaging makes it easy to integrate this power management IC onto printed circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage (Vsup): 3.3 V

The nominal supply voltage of 3.3V allows compatibility with a wide range of systems and devices, making it versatile for various applications.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

The grid array packaging with a very thin profile and fine pitch allows for high-density mounting, ideal for compact electronic devices.

Operating Temperature Range: -40°C to 125°C

The wide operating temperature range makes this power management IC suitable for automotive applications and other environments with temperature fluctuations.

Terminal Finish: TIN SILVER COPPER

The terminal finish of tin, silver, and copper provides excellent conductivity and corrosion resistance, ensuring reliable performance and longevity.

Width (mm): 1.388 mm

The narrow width of 1.388mm allows for space-saving and compact designs in electronic systems.

Minimum Supply Voltage (Vsup): 2.7 V

The low minimum supply voltage requirement of 2.7V allows for operation in low-power applications, improving energy efficiency.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures that this power management IC can withstand the harsh conditions typically found in automotive environments.

Maximum Supply Current (Isup): 0.42 mA

The low maximum supply current requirement of 0.42 mA helps in reducing power consumption and extending battery life in portable devices.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V provides protection against overvoltage conditions, ensuring the safety and reliability of connected devices.

Technical Specifications

Power Management ICs HPA02149AIYFFR attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

NO

JESD-30 Code:

R-XBGA-B12

JESD-609 Code:

e1

Length:

1.6445 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

.625 mm

Maximum Supply Current (Isup):

.42 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Nominal Threshold Voltage (V):

+2V

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1.388 mm

Trade Compliance

HPA02149AIYFFR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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