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DLPC4422AZPC

Texas Instruments

DLPC4422AZPC by Texas Instruments

DLPC4422AZPC by Texas Instruments is a consumer IC with 516 terminals in a grid array package. It operates b/w 0-111°C, with Vsup ranging from 1.045V to 1.155V. This square-shaped IC is ideal for various consumer circuit applications due to its compact size and surface-mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,357 parts In-Stock

1+ parts

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4,357

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Digiode

USA . 966 parts In-Stock

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966

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 220 parts In-Stock

1+ parts

$1.138

100+ parts

-

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220

$1.138

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Northwest PG Solutions

USA . 1,052 parts In-Stock

1+ parts

$1.252

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1,052

$1.252

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Parana Technologies

USA . 2,027 parts In-Stock

1+ parts

$2.210

100+ parts

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1k+ parts

$2.717

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2,027

$2.210

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$2.717

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ChromeModa Solutions

Germany . 2,242 parts In-Stock

1+ parts

$2.483

100+ parts

$2.036

1k+ parts

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2,242

$2.483

$2.036

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IDEA Electronic Components Group

UK . 854 parts In-Stock

1+ parts

$2.483

100+ parts

-

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$2.235

10k+ parts

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854

$2.483

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$2.235

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One Stop Electronics

USA . 608 parts In-Stock

1+ parts

$4.800

100+ parts

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608

$4.800

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AZTECH Wire

Italy . 798 parts In-Stock

1+ parts

$10.095

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798

$10.095

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Corphita

USA . 2,222 parts In-Stock

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2,222

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Microchip USA

USA . 2,097 parts In-Stock

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2,097

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DigiPath Technology Company

USA . 1,113 parts In-Stock

1+ parts

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100+ parts

$2.239

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1,113

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$2.239

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Overview

Experience unparalleled quality and innovation with the DLPC4422AZPC by Texas Instruments. As a leader in the industry, Texas Instruments delivers cutting-edge solutions for consumer electronics with this versatile product. The DLPC4422AZPC offers a wide range of applications in consumer circuits, providing customers with exceptional value and performance. Whether you're looking to enhance your digital display or improve overall functionality, this product is designed to meet your needs. Trust Texas Instruments for reliable, high-quality components that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to physical damage, making this product suitable for various applications.

Surface Mount: YES

Being surface mountable makes installation easier and more efficient, saving time and effort during assembly.

Package Shape: SQUARE

The square package shape allows for compact and efficient PCB design, optimizing space utilization in electronic devices.

Maximum Operating Temperature: 111 °C

With a high maximum operating temperature, this product can withstand challenging environmental conditions, ensuring reliable performance in demanding applications.

Minimum Supply Voltage (Vsup): 1.045 V

The low minimum supply voltage requirement allows for energy-efficient operation, reducing power consumption and prolonging battery life.

Technical Specifications

Other Function Consumer ICs DLPC4422AZPC attributes and parameters. Explore more Other Function Consumer ICs devices from Texas Instruments

Specs

General IC Type:

JESD-30 Code:

S-PBGA-B516

Length:

27 mm

No. of Functions:

1

No. of Terminals:

516

Maximum Operating Temperature:

111 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

BGA

Package Equivalence Code:

BGA516,26X26,40

Package Shape:

Package Style (Meter):

GRID ARRAY

Maximum Seated Height:

2.42 mm

Maximum Supply Voltage (Vsup):

1.155 V

Minimum Supply Voltage (Vsup):

1.045 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

27 mm

Trade Compliance

DLPC4422AZPC General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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