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CSD19535KTT

Texas Instruments

CSD19535KTT by Texas Instruments

CSD19535KTT by Texas Instruments is an N-CHANNEL FET for SWITCHING applications. It features a 100V DS Breakdown Voltage, 400A IDM, and 0.0041 ohm Drain-Source On Resistance. With a max operating temperature of 175°C, this MOSFET in SMALL OUTLINE package is ideal for high-power switching circuits.

Median Price

$3.304

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 32,089 parts In-Stock

1+ parts

$2.258

100+ parts

$1.979

1k+ parts

$1.118

10k+ parts

-

32,089

$2.258

$1.979

$1.118

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Mouser Electronics

USA . 137 parts In-Stock

1+ parts

$4.350

100+ parts

$2.050

1k+ parts

$1.600

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-

137

$4.350

$2.050

$1.600

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DigiKey

USA . 42 parts In-Stock

1+ parts

$4.410

100+ parts

$2.041

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-

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42

$4.410

$2.041

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Arrow

USA . 1,000 parts In-Stock

1+ parts

-

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$1.668

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1,000

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$1.668

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Distributors (In-Stock)

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Nova Conductors

Japan . 73 parts In-Stock

1+ parts

$2.070

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-

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73

$2.070

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Digiode

USA . 1,529 parts In-Stock

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$2.145

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1,529

$2.145

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TME

Poland . 207 parts In-Stock

1+ parts

$3.560

100+ parts

$1.960

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207

$3.560

$1.960

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Component Sense

UK . 5,178 parts In-Stock

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Vyrian

USA . 5,050 parts In-Stock

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5,050

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Bristol Electronics

USA . 167 parts In-Stock

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167

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,192 parts In-Stock

1+ parts

$0.770

100+ parts

-

1k+ parts

$1.765

10k+ parts

-

1,192

$0.770

-

$1.765

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DigiPath Technology Company

USA . 1,521 parts In-Stock

1+ parts

$0.848

100+ parts

$0.780

1k+ parts

-

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1,521

$0.848

$0.780

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ChromeModa Solutions

Germany . 2,987 parts In-Stock

1+ parts

$0.865

100+ parts

$0.709

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-

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2,987

$0.865

$0.709

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IDEA Electronic Components Group

UK . 970 parts In-Stock

1+ parts

$0.865

100+ parts

-

1k+ parts

$0.778

10k+ parts

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970

$0.865

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$0.778

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Corohmni

South Africa . 115 parts In-Stock

1+ parts

$1.269

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115

$1.269

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Semicontronic

India . 10,740 parts In-Stock

1+ parts

$1.920

100+ parts

$1.872

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$1.862

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10,740

$1.920

$1.872

$1.862

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Ampacity Inc.

Singapore . 10,657 parts In-Stock

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$1.920

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10,657

$1.920

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Aranea Global

USA . 500 parts In-Stock

1+ parts

$2.029

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$1.947

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500

$2.029

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$1.947

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Corphita

USA . 3,023 parts In-Stock

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$2.032

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3,023

$2.032

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Continental Prestige Electronics

USA . 3,089 parts In-Stock

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$2.070

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$2.029

3,089

$2.070

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$2.029

Argo Parts USA

USA . 428 parts In-Stock

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$2.070

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428

$2.070

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Lixinc

USA . 9,569 parts In-Stock

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Perfect Parts

USA . 8,960 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,849 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,566 parts In-Stock

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4,566

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Kepictronics

USA . 3,000 parts In-Stock

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Authorized Procurement Solutions

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GreenTree Electronics

Israel . 100 parts In-Stock

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100

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Overview

Enhance the performance of your electronic devices with the CSD19535KTT by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality power FETs that are perfect for switching applications. This N-channel transistor offers reliability and efficiency, allowing for seamless operation in various electronic systems. With a high breakdown voltage and low resistance, this transistor ensures optimal performance. Upgrade your devices with the CSD19535KTT and experience the superior quality and value that Texas Instruments provides.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this FET lightweight and durable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower on-resistance and higher transconductance, making them more efficient for switching applications.

Configuration: SINGLE

The single configuration simplifies circuit design and reduces component count, making it space-efficient.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides fast switching speeds and low on-resistance.

Surface Mount: YES

Being surface mount compatible allows for easy and efficient PCB assembly.

Minimum DS Breakdown Voltage: 100 V

The high minimum breakdown voltage ensures robust performance and protection against voltage spikes.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement and secure mounting on the PCB.

Terminal Form: GULL WING

The gull wing terminal form makes it easy to solder and ensures a strong connection.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to integrate into most circuits and offer improved performance.

Maximum Pulsed Drain Current (IDM): 400 A

The high maximum pulsed drain current rating allows for handling high peak currents without damage.

Avalanche Energy Rating (EAS): 451 mJ

The high avalanche energy rating provides protection against voltage spikes and transient events.

No. of Terminals: 2

With only 2 terminals, this FET is easy to connect and integrate into circuits.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and allows for high component density.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds, low on-resistance, and low power consumption.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature allows for operation in a wide range of environments.

Transistor Element Material: SILICON

Silicon is a commonly used material for FETs due to its high thermal conductivity and reliability.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures performance even in extremely cold conditions.

Terminal Finish: MATTE TIN

The matte tin finish provides reliable solder joints and corrosion resistance.

Maximum Drain Current (ID): 200 A

The high maximum drain current rating allows for handling high continuous currents without damage.

Maximum Drain-Source On Resistance: 0.0041 ohm

The low on-resistance minimizes power loss and heat generation in the FET.

Terminal Position: SINGLE

The single terminal position simplifies PCB layout and component placement.

Moisture Sensitivity Level (MSL): 2

MSL 2 indicates a moderate level of moisture sensitivity, suitable for most environments.

Case Connection: DRAIN

The drain case connection simplifies circuit design and cooling options.

Maximum Time At Peak Reflow Temperature (s): 30

This FET can withstand peak reflow temperatures for up to 30 seconds during assembly.

Peak Reflow Temperature °C: 260

The high peak reflow temperature rating allows for reliable soldering during assembly.

Maximum Feedback Capacitance (Crss): 38 pF

The low feedback capacitance minimizes high-frequency signal distortion and improves performance.

Technical Specifications

Power Field Effect Transistors (FET) CSD19535KTT attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

451 mJ

Case Connection:

DRAIN

Configuration:

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

200 A

Maximum Drain-Source On Resistance:

.0041 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

38 pF

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

400 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CSD19535KTT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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