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CSD18511KTT

Texas Instruments

CSD18511KTT by Texas Instruments

CSD18511KTT by Texas Instruments is an N-CHANNEL Power FET with a 40V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 400A and EAS of 156mJ, operating in ENHANCEMENT MODE. With a low 0.0042 ohm Drain-Source On Resistance, this FET is suitable for high-current switching circuits.

Median Price

$2.490

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 15,992 parts In-Stock

1+ parts

$1.279

100+ parts

$0.984

1k+ parts

$0.518

10k+ parts

-

15,992

$1.279

$0.984

$0.518

-

Mouser Electronics

USA . 493 parts In-Stock

1+ parts

$2.490

100+ parts

$1.100

1k+ parts

$0.765

10k+ parts

$0.740

493

$2.490

$1.100

$0.765

$0.740

DigiKey

USA . 475 parts In-Stock

1+ parts

$2.490

100+ parts

$1.090

1k+ parts

-

10k+ parts

-

475

$2.490

$1.090

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,352 parts In-Stock

1+ parts

$1.215

100+ parts

-

1k+ parts

-

10k+ parts

-

3,352

$1.215

-

-

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Vyrian

USA . 3,315 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3,315

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 245 parts In-Stock

1+ parts

$0.732

100+ parts

-

1k+ parts

-

10k+ parts

-

245

$0.732

-

-

-

Parana Technologies

USA . 160 parts In-Stock

1+ parts

$0.826

100+ parts

-

1k+ parts

$1.794

10k+ parts

-

160

$0.826

-

$1.794

-

DigiPath Technology Company

USA . 1,410 parts In-Stock

1+ parts

$0.909

100+ parts

$0.837

1k+ parts

-

10k+ parts

-

1,410

$0.909

$0.837

-

-

ChromeModa Solutions

Germany . 3,757 parts In-Stock

1+ parts

$0.928

100+ parts

$0.761

1k+ parts

-

10k+ parts

-

3,757

$0.928

$0.761

-

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IDEA Electronic Components Group

UK . 1,691 parts In-Stock

1+ parts

$0.928

100+ parts

-

1k+ parts

$0.835

10k+ parts

-

1,691

$0.928

-

$0.835

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Ampacity Inc.

Singapore . 5,361 parts In-Stock

1+ parts

$1.090

100+ parts

-

1k+ parts

-

10k+ parts

-

5,361

$1.090

-

-

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Semicontronic

India . 5,068 parts In-Stock

1+ parts

$1.090

100+ parts

$1.063

1k+ parts

$1.057

10k+ parts

-

5,068

$1.090

$1.063

$1.057

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Corphita

USA . 1,958 parts In-Stock

1+ parts

$1.151

100+ parts

-

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-

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1,958

$1.151

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Native Components

USA . 164 parts In-Stock

1+ parts

$12.705

100+ parts

-

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164

$12.705

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Northwest PG Solutions

USA . 1,271 parts In-Stock

1+ parts

$13.975

100+ parts

$12.578

1k+ parts

-

10k+ parts

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1,271

$13.975

$12.578

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QUARKTWIN TECHNOLOGY LTD

USA . 24,552 parts In-Stock

1+ parts

-

100+ parts

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24,552

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Overview

Experience the superior quality and reliability of Texas Instruments with the CSD18511KTT Power Field Effect Transistor. This N-CHANNEL SWITCHING transistor offers enhanced performance and efficiency for a wide range of applications. With a maximum Drain Current of 110A and low On Resistance, this transistor provides exceptional power handling capabilities. Trust in Texas Instruments for cutting-edge technology and maximize the potential of your electronic designs with the CSD18511KTT.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material offers durability and protection for the FET, making it suitable for a wide range of applications.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their low ON resistance, high input impedance, and fast switching speeds, making them ideal for switching applications.

Minimum DS Breakdown Voltage: 40 V

With a minimum breakdown voltage of 40V, this FET can handle higher voltage loads effectively.

Maximum Pulsed Drain Current (IDM): 400 A

The high pulsed drain current rating of 400A allows for heavy-duty applications where high current handling capability is required.

Maximum Operating Temperature: 175 °C

The FET can operate at high temperatures up to 175°C, making it suitable for automotive, industrial, and other harsh environments.

Maximum Drain-Source On Resistance: 0.0042 ohm

The low ON resistance of 0.0042 ohm ensures minimal power loss and efficient performance in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) CSD18511KTT attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

156 mJ

Case Connection:

DRAIN

Configuration:

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (ID):

110 A

Maximum Drain-Source On Resistance:

.0042 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

306 pF

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

400 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CSD18511KTT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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