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CSD17506Q5A

Texas Instruments

CSD17506Q5A by Texas Instruments

CSD17506Q5A by Texas Instruments is a N-CHANNEL FET for SWITCHING applications. Features include 30V DS Breakdown Voltage, 150A IDM, and 0.0053 ohm Drain-Source On Resistance. Ideal for high-power switching circuits in various electronic devices.

Median Price

$1.180

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 7,075 parts In-Stock

1+ parts

$1.161

100+ parts

$0.893

1k+ parts

$0.470

10k+ parts

-

7,075

$1.161

$0.893

$0.470

-

Farnell

UK . 2,063 parts In-Stock

1+ parts

$1.200

100+ parts

$0.778

1k+ parts

$0.500

10k+ parts

$0.490

2,063

$1.200

$0.778

$0.500

$0.490

Chip1Stop

Japan . 2,068 parts In-Stock

1+ parts

$2.160

100+ parts

$0.932

1k+ parts

$0.711

10k+ parts

$0.639

2,068

$2.160

$0.932

$0.711

$0.639

Arrow

USA . 2,500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.572

2,500

-

-

-

$0.572

Distributors (In-Stock)

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Digiode

USA . 1,186 parts In-Stock

1+ parts

$1.102

100+ parts

-

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-

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1,186

$1.102

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Mobius Materials

USA . 487 parts In-Stock

1+ parts

$1.960

100+ parts

$1.570

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-

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487

$1.960

$1.570

-

-

Chip Stock

USA . 23,500 parts In-Stock

1+ parts

-

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23,500

-

-

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Cyclops Electronics Ltd

UK . 13,314 parts In-Stock

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-

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13,314

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Vyrian

USA . 4,450 parts In-Stock

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4,450

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Prism Electronics

USA . 230 parts In-Stock

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230

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Connect4Technologies Inc.

Canada . 185 parts In-Stock

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-

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185

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Semi Source

USA . 183 parts In-Stock

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183

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Distributors (Availability)

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Native Components

USA . 280 parts In-Stock

1+ parts

$0.285

100+ parts

-

1k+ parts

-

10k+ parts

$0.273

280

$0.285

-

-

$0.273

Northwest PG Solutions

USA . 2,060 parts In-Stock

1+ parts

$0.313

100+ parts

-

1k+ parts

-

10k+ parts

$0.276

2,060

$0.313

-

-

$0.276

Corphita

USA . 140 parts In-Stock

1+ parts

$1.044

100+ parts

-

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140

$1.044

-

-

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Parana Technologies

USA . 1,462 parts In-Stock

1+ parts

$1.153

100+ parts

-

1k+ parts

$1.967

10k+ parts

-

1,462

$1.153

-

$1.967

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DigiPath Technology Company

USA . 606 parts In-Stock

1+ parts

$1.270

100+ parts

$1.168

1k+ parts

-

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606

$1.270

$1.168

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ChromeModa Solutions

Germany . 3,694 parts In-Stock

1+ parts

$1.296

100+ parts

$1.063

1k+ parts

-

10k+ parts

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3,694

$1.296

$1.063

-

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IDEA Electronic Components Group

UK . 319 parts In-Stock

1+ parts

$1.296

100+ parts

-

1k+ parts

$1.166

10k+ parts

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319

$1.296

-

$1.166

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Perfect Parts

USA . 43,960 parts In-Stock

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43,960

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A-Z Elektronik GmbH

Germany . 7,137 parts In-Stock

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7,137

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GreenTree Electronics

Israel . 6,814 parts In-Stock

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6,814

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Alle Elektronik GmbH

Germany . 4,758 parts In-Stock

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4,758

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Lixinc

USA . 4,492 parts In-Stock

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4,492

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Kepictronics

USA . 111 parts In-Stock

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111

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Overview

Experience the superior quality and reliability of the CSD17506Q5A by Texas Instruments, a top-of-the-line Power Field Effect Transistor. Designed for switching applications, this N-Channel FET offers unmatched performance with a built-in diode, ensuring seamless operation. With a maximum pulsed drain current of 150A and an avalanche energy rating of 259mJ, this transistor is a powerhouse in a compact rectangular package. Trust Texas Instruments for cutting-edge technology and elevate your projects with the CSD17506Q5A.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

Allows for efficient control of the flow of current, making it suitable for a variety of switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps to protect against voltage spikes and reverse currents in the circuit.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in various electronic systems.

Maximum Pulsed Drain Current (IDM): 150 A

Capable of handling high current loads during short pulses, making it suitable for high power applications.

Maximum Power Dissipation (Abs): 3.2 W

Efficiently dissipates heat generated during operation, preventing overheating and ensuring stable performance.

Maximum Operating Temperature: 150 °C

Can operate effectively in high temperature environments, providing flexibility in application usage.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizes advanced semiconductor technology for improved efficiency and performance.

Technical Specifications

Power Field Effect Transistors (FET) CSD17506Q5A attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

259 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

100 A

Maximum Drain Current (ID):

23 A

Maximum Drain-Source On Resistance:

.0053 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

65 pF

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

150 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CSD17506Q5A Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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