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CSD16325Q5C

Texas Instruments

CSD16325Q5C by Texas Instruments

CSD16325Q5C by Texas Instruments is a N-CHANNEL FET with 25V DS Breakdown Voltage, ideal for SWITCHING applications. It features 200A IDM, 500mJ EAS, and 0.0029 ohm Drain-Source On Resistance. This SINGLE transistor in PLASTIC/EPOXY package operates from -55 to 150 °C and has a max power dissipation of 3.1W.

Median Price

$1.800

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 52 parts In-Stock

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$1.800

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$1.116

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Vyrian

USA . 8,295 parts In-Stock

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8,295

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Cyclops Electronics Ltd

UK . 3,413 parts In-Stock

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3,413

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Digiode

USA . 794 parts In-Stock

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794

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Prism Electronics

USA . 174 parts In-Stock

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Holdelec - ElecDif-Pro

France . 81 parts In-Stock

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Microfarads

USA . 50 parts In-Stock

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50

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ACDS - Activité Composants Distribution Service

France . 50 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 2,055 parts In-Stock

1+ parts

$1.271

100+ parts

-

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$2.035

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2,055

$1.271

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$2.035

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DigiPath Technology Company

USA . 63 parts In-Stock

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$1.399

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63

$1.399

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IDEA Electronic Components Group

UK . 935 parts In-Stock

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$1.428

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$1.285

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935

$1.428

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$1.285

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ChromeModa Solutions

Germany . 647 parts In-Stock

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$1.428

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$1.171

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647

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AZTECH Wire

Italy . 693 parts In-Stock

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$12.390

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693

$12.390

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Ampacity Inc.

Singapore . 1,301 parts In-Stock

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$16.050

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$16.050

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One Stop Electronics

USA . 863 parts In-Stock

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$40.050

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863

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Perfect Parts

USA . 31,451 parts In-Stock

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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Northwest PG Solutions

USA . 1,346 parts In-Stock

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$4.639

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Native Components

USA . 652 parts In-Stock

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652

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Corphita

USA . 89 parts In-Stock

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89

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GreenTree Electronics

Israel . 82 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 82 parts In-Stock

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Kepictronics

USA . 50 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 50 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the CSD16325Q5C from Texas Instruments, a high-quality N-CHANNEL Power FET perfect for switching applications. With a maximum operating temperature of 150° °C and a small outline package style, this transistor offers reliability and efficiency in a compact design. Benefit from its built-in diode, low on-resistance, and high drain current capabilities to optimize your circuitry and improve overall system performance. Trust in Texas Instruments' reputation for excellence and choose the CSD16325Q5C for all your power transistor needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the FET, making it suitable for various applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for high efficiency and fast switching speeds, making the FET ideal for switching applications.

Maximum Pulsed Drain Current (IDM): 200 A

The high maximum pulsed drain current capability ensures that the FET can handle sudden surges in current without damage, making it reliable in demanding conditions.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, the FET can operate effectively in a wide range of environments without overheating or performance degradation.

Maximum Drain-Source On Resistance: 0.0029 ohm

The low drain-source on resistance results in minimal power loss and efficient operation of the FET, making it energy-efficient and suitable for high-performance applications.

Technical Specifications

Power Field Effect Transistors (FET) CSD16325Q5C attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Texas Instruments

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

500 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

100 A

Maximum Drain Current (ID):

33 A

Maximum Drain-Source On Resistance:

.0029 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

200 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CSD16325Q5C Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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