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COP8SGR744V8/63SN

Texas Instruments

COP8SGR744V8/63SN by Texas Instruments

COP8SGR744V8/63SN by Texas Instruments is an 8-bit microcontroller with a max clock frequency of 15 MHz. It features 512 bytes of RAM, SPI connectivity, and OTPROM ROM programmability. Ideal for industrial applications requiring a compact chip carrier package with 44 terminals and operating temperatures ranging from -40 to 85°C.

Median Price

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Lifecycle Status

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2

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1k+

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Vyrian

USA . 7,278 parts In-Stock

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Digiode

USA . 1,947 parts In-Stock

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Native Components

USA . 354 parts In-Stock

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$8.365

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354

$8.365

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Northwest PG Solutions

USA . 2,375 parts In-Stock

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$9.201

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$8.281

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One Stop Electronics

USA . 828 parts In-Stock

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$11.000

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AZTECH Wire

Italy . 415 parts In-Stock

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$17.953

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Parana Technologies

USA . 168 parts In-Stock

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$57.499

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DigiPath Technology Company

USA . 354 parts In-Stock

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$63.314

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$58.249

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ChromeModa Solutions

Germany . 2,893 parts In-Stock

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$64.606

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$52.977

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IDEA Electronic Components Group

UK . 2,355 parts In-Stock

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$64.606

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$61.376

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$58.145

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Component Stockers USA

USA . 496 parts In-Stock

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$99.990

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Corphita

USA . 4,194 parts In-Stock

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Microchip USA

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Overview

Discover the power and precision of Texas Instruments with the COP8SGR744V8/63SN microcontroller. Perfect for a wide range of applications, this high-quality chip offers unmatched reliability and performance. With advanced features like PWM and timers, you can trust this microcontroller to deliver seamless connectivity and optimal functionality. Upgrade your projects with the cutting-edge technology of Texas Instruments and experience the difference for yourself.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy integration onto PCBs and saves space, making it suitable for compact designs.

Maximum Supply Voltage: 5.5 V

Can tolerate higher voltage inputs, providing flexibility in power supply options.

Package Shape: SQUARE

Square shape offers uniformity and ease of design for placement on the circuit board.

No. of Terminals: 44

Sufficient number of terminals for connectivity options and expansion capabilities.

Minimum Supply Voltage: 2.7 V

Operates at low voltage, suitable for power-efficient applications.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments.

CPU Family: COP800

Part of a reliable and efficient CPU family, ensuring compatibility and performance.

ROM Words: 32768

Large ROM capacity allows for storing critical program data and instructions.

Width: 16.585 mm

Compact width enables space-saving integration into various electronic devices.

Peripherals: PWM, TIMER(3)

Includes essential peripherals for timing and control functions, enhancing functionality.

Maximum Clock Frequency: 15 MHz

Operates at high clock speeds, suitable for real-time processing and responsiveness.

Temperature Grade: INDUSTRIAL

Designed to withstand harsh industrial environments, ensuring reliability and performance.

ROM Programmability: OTPROM

One-Time Programmable ROM provides secure and permanent data storage for critical information.

Maximum Supply Current: 9 mA

Low supply current consumption for power-efficient operation.

Connectivity: SPI

Supports SPI connectivity for easy communication with other devices and peripherals.

Moisture Sensitivity Level (MSL): 3

Moderate moisture sensitivity level for reliability in various environmental conditions.

Technical Specifications

Microcontrollers COP8SGR744V8/63SN attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

NO

Bit Size:

8

CPU Family:

COP800

Maximum Clock Frequency:

15 MHz

DAC Channels:

NO

DMA Channels:

NO

JESD-30 Code:

S-PQCC-J44

JESD-609 Code:

e3

Length:

16.585 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

40

No. of Terminals:

44

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC44,.7SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

245

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

32768

ROM Programmability:

OTPROM

Maximum Seated Height:

4.57 mm

Speed:

15 rpm

Maximum Supply Current:

9 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

16.585 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

SPI

Peripherals:

PWM, TIMER(3)

Trade Compliance

COP8SGR744V8/63SN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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