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COP8SAA716M8/63SN

Texas Instruments

COP8SAA716M8/63SN by Texas Instruments

The Texas Instruments COP8SAA716M8/63SN is a CMOS microcontroller with matte tin finish. It has a peak reflow temperature of 260°C and can withstand 30s at this temperature. Ideal for applications requiring high-performance microcontrollers in various industries.

Median Price

$3.710

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,000 parts In-Stock

1+ parts

$3.710

100+ parts

$3.640

1k+ parts

$3.560

10k+ parts

-

1,000

$3.710

$3.640

$3.560

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,392 parts In-Stock

1+ parts

-

100+ parts

-

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4,392

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-

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Digiode

USA . 998 parts In-Stock

1+ parts

-

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998

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 626 parts In-Stock

1+ parts

$0.519

100+ parts

-

1k+ parts

-

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626

$0.519

-

-

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Northwest PG Solutions

USA . 1,948 parts In-Stock

1+ parts

$0.571

100+ parts

-

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10k+ parts

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1,948

$0.571

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AZTECH Wire

Italy . 363 parts In-Stock

1+ parts

$9.448

100+ parts

-

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363

$9.448

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-

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One Stop Electronics

USA . 624 parts In-Stock

1+ parts

$13.000

100+ parts

-

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-

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624

$13.000

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-

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Parana Technologies

USA . 691 parts In-Stock

1+ parts

$48.301

100+ parts

-

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691

$48.301

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-

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DigiPath Technology Company

USA . 1,089 parts In-Stock

1+ parts

$53.186

100+ parts

-

1k+ parts

-

10k+ parts

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1,089

$53.186

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-

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ChromeModa Solutions

Germany . 2,625 parts In-Stock

1+ parts

$54.271

100+ parts

$44.502

1k+ parts

-

10k+ parts

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2,625

$54.271

$44.502

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IDEA Electronic Components Group

UK . 1,738 parts In-Stock

1+ parts

$54.271

100+ parts

$51.557

1k+ parts

$48.844

10k+ parts

-

1,738

$54.271

$51.557

$48.844

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QUARKTWIN TECHNOLOGY LTD

USA . 5,043 parts In-Stock

1+ parts

-

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1k+ parts

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5,043

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Microchip USA

USA . 3,656 parts In-Stock

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3,656

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Corphita

USA . 3,234 parts In-Stock

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3,234

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Overview

Unlock the power of innovation with the COP8SAA716M8/63SN microcontroller from Texas Instruments. Known for their top-notch quality and reliability, Texas Instruments delivers cutting-edge technology that exceeds expectations. Perfect for a wide range of applications, this microcontroller offers unparalleled value and benefits to customers looking for seamless performance and efficiency. Elevate your projects to the next level with the unmatched advantages of the COP8SAA716M8/63SN.

Feature Benefit Bullets

Terminal Finish: MATTE TIN

This terminal finish provides good solderability and corrosion resistance, ensuring reliable connections between the microcontroller and other components.

Maximum Time At Peak Reflow Temperature (s): 30

The short reflow time reduces the risk of thermal damage to the microcontroller during assembly, preserving its functionality and longevity.

Peak Reflow Temperature °C: 260

This high peak reflow temperature allows for efficient and reliable soldering of the microcontroller, ensuring a strong bond with the PCB for optimal performance.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, this product offers versatile functionality for handling various input/output tasks, making it suitable for a wide range of applications.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide voltage range, making the microcontroller energy-efficient and reliable in different environments.

Moisture Sensitivity Level (MSL): 3

With an MSL of 3, this microcontroller is suitable for reflow soldering and has a moderate moisture sensitivity level, making it easier to handle during assembly processes.

Technical Specifications

Microcontrollers COP8SAA716M8/63SN attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

Peak Reflow Temperature (C):

260

Technology:

CMOS

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Peripheral IC Type:

Trade Compliance

COP8SAA716M8/63SN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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