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CLVTH16835IDGGREP

Texas Instruments

CLVTH16835IDGGREP by Texas Instruments

CLVTH16835IDGGREP by Texas Instruments is an 18-bit bus driver with a propagation delay of 5.7 ns, suitable for industrial applications. It operates at a nominal voltage of 3.3 V and has a temperature range from -40 to 85 °C, making it ideal for various electronic systems requiring fast signal transmission in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,800 parts In-Stock

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2,800

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Digiode

USA . 2,613 parts In-Stock

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2,613

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Distributors (Availability)

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Native Components

USA . 380 parts In-Stock

1+ parts

$2.138

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380

$2.138

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Northwest PG Solutions

USA . 1 parts In-Stock

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$2.351

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1

$2.351

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Andel Nordic

Denmark . 639 parts In-Stock

1+ parts

$6.547

100+ parts

-

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$6.285

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$6.285

639

$6.547

-

$6.285

$6.285

Parana Technologies

USA . 2,011 parts In-Stock

1+ parts

$13.134

100+ parts

$1,219.666

1k+ parts

$11.820

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2,011

$13.134

$1,219.666

$11.820

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DigiPath Technology Company

USA . 2,315 parts In-Stock

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$14.462

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2,315

$14.462

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ChromeModa Solutions

Germany . 5,748 parts In-Stock

1+ parts

$14.757

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$12.101

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5,748

$14.757

$12.101

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IDEA Electronic Components Group

UK . 1,590 parts In-Stock

1+ parts

$14.757

100+ parts

$14.019

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$13.281

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1,590

$14.757

$14.019

$13.281

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AZTECH Wire

Italy . 453 parts In-Stock

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$17.867

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453

$17.867

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One Stop Electronics

USA . 523 parts In-Stock

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$41.000

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523

$41.000

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Metaverse IC Inc.

Canada . 5,000 parts In-Stock

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Perfect Parts

USA . 2,677 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,296 parts In-Stock

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Corphita

USA . 1,240 parts In-Stock

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Microchip USA

USA . 366 parts In-Stock

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366

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Overview

Experience seamless data transmission with the CLVTH16835IDGGREP by Texas Instruments, a top-tier manufacturer known for its quality products. As a Bus Driver & Transceiver, this device offers reliable performance in various applications. With a compact design and advanced technology, it provides 3-STATE output characteristics and a fast propagation delay of just 5.7 ns. Ideal for industrial use, this product ensures efficient data transfer with a nominal supply voltage of 3.3 V. Trust Texas Instruments to deliver high-value solutions that exceed your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for use in various environments.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on PCBs, saving space and simplifying manufacturing processes.

No. of Bits: 18

Having 18 bits allows for a higher level of data transmission and processing capability, making this product suitable for complex communication systems.

Nominal Supply Voltage / Vsup (V): 3.3

The nominal supply voltage of 3.3V ensures compatibility with a wide range of devices and systems, making it versatile in application.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can withstand high temperatures, making it suitable for industrial use.

Output Characteristics: 3-STATE

The 3-STATE output characteristics offer flexibility in controlling the output signal, allowing for efficient communication and data transfer.

Technology: BICMOS

Utilizing BICMOS technology ensures high performance and efficiency in signal processing, making this product a reliable choice for bus driver and transceiver applications.

Technical Specifications

Bus Driver & Transceivers CLVTH16835IDGGREP attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Family:

LVT

JESD-30 Code:

R-PDSO-G56

JESD-609 Code:

e4

Length:

14 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

18

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

5.7 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6.1 mm

Trade Compliance

CLVTH16835IDGGREP Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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