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CDCV855PWG4

Texas Instruments

CDCV855PWG4 by Texas Instruments

CDCV855PWG4 clock driver by Texas Instruments operates at 2.5V, with 28 terminals and a load capacitance of 14pF. It features a propagation delay of 4.5ns, output in 3-STATE, and is ideal for applications requiring differential input conditioning and a max operating temperature of 70°C.

Median Price

$5.824

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 35 parts In-Stock

1+ parts

$5.824

100+ parts

$2.912

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35

$5.824

$2.912

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Vyrian

USA . 6,530 parts In-Stock

1+ parts

-

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6,530

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Digiode

USA . 3,066 parts In-Stock

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3,066

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Microfarads

USA . 34 parts In-Stock

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34

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Sea View Technologies

USA . 17 parts In-Stock

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17

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 494 parts In-Stock

1+ parts

$13.029

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-

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494

$13.029

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Parana Technologies

USA . 1,702 parts In-Stock

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$25.818

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-

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$26.422

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1,702

$25.818

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$26.422

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One Stop Electronics

USA . 849 parts In-Stock

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$27.000

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849

$27.000

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DigiPath Technology Company

USA . 2,264 parts In-Stock

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$28.429

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2,264

$28.429

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ChromeModa Solutions

Germany . 936 parts In-Stock

1+ parts

$29.009

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$23.787

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936

$29.009

$23.787

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IDEA Electronic Components Group

UK . 562 parts In-Stock

1+ parts

$29.009

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$27.559

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$26.108

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562

$29.009

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Corphita

USA . 4,765 parts In-Stock

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Microchip USA

USA . 1,619 parts In-Stock

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Northwest PG Solutions

USA . 960 parts In-Stock

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$4.337

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$4.337

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Native Components

USA . 529 parts In-Stock

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$4.293

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529

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Perfect Parts

USA . 122 parts In-Stock

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Overview

Upgrade your clock drivers and buffers with the CDCV855PWG4 by Texas Instruments, a top-quality product designed for precision and reliability. Texas Instruments is known for its exceptional manufacturing standards, ensuring that this device meets the highest industry requirements. Clock drivers & buffers are essential components in electronic systems, providing accurate synchronization and signal integrity. With the CDCV855PWG4, you can expect seamless performance, low power consumption, and versatile applications across various industries. Trust Texas Instruments to deliver superior products that add value to your projects and enhance overall efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material of the package body ensures durability and resistance to external elements, making it a reliable choice for long-term use.

Surface Mount: YES

The surface mount feature allows for easy installation on circuit boards, saving space and improving overall assembly efficiency.

Propagation Delay (tpd): 4.5 ns

With a low propagation delay, this clock driver and buffer ensures fast and efficient signal transmission, reducing latency in the system.

Output Characteristics: 3-STATE

The 3-STATE output characteristics provide flexibility in controlling the output signal, allowing for tri-state logic operation and minimizing power consumption.

Temperature Grade: COMMERCIAL

Designed for commercial applications, this clock driver and buffer operates reliably within standard temperature ranges, making it suitable for a wide range of consumer electronics.

Technical Specifications

Clock Drivers & Buffers CDCV855PWG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

855

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

9.7 mm

Load Capacitance (CL):

14 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

4

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP28,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.5

Propagation Delay (tpd):

4.5 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1.2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

2.7 V

Minimum Supply Voltage (Vsup):

2.3 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Minimum fmax:

180 MHz

Trade Compliance

CDCV855PWG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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