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CDCFR83ADBQRG4

Texas Instruments

CDCFR83ADBQRG4 by Texas Instruments

Texas Instruments CDCFR83ADBQRG4 clock driver features 533 MHz fmax, 3.3V supply voltage, and -40 to 85°C operating temperature range. Ideal for industrial applications requiring high-speed clock signal distribution in compact designs with surface mount capability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,972 parts In-Stock

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Digiode

USA . 1,211 parts In-Stock

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1,211

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Distributors (Availability)

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Native Components

USA . 494 parts In-Stock

1+ parts

$8.107

100+ parts

-

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494

$8.107

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Northwest PG Solutions

USA . 1,313 parts In-Stock

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$8.917

100+ parts

$8.026

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1,313

$8.917

$8.026

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AZTECH Wire

Italy . 409 parts In-Stock

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$9.645

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409

$9.645

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Andel Nordic

Denmark . 13 parts In-Stock

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$10.792

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$10.360

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$10.360

13

$10.792

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$10.360

$10.360

Parana Technologies

USA . 159 parts In-Stock

1+ parts

$12.658

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$13.121

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159

$12.658

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$13.121

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ChromeModa Solutions

Germany . 6,272 parts In-Stock

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$14.222

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$11.662

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6,272

$14.222

$11.662

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IDEA Electronic Components Group

UK . 649 parts In-Stock

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$14.222

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$13.511

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$12.800

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649

$14.222

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One Stop Electronics

USA . 869 parts In-Stock

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$30.000

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$30.000

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Component Stockers USA

USA . 755 parts In-Stock

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$99.990

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$99.990

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Microchip USA

USA . 4,976 parts In-Stock

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Corphita

USA . 3,457 parts In-Stock

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DigiPath Technology Company

USA . 419 parts In-Stock

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$12.823

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$12.823

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Overview

Enhance the performance and reliability of your electronic devices with the CDCFR83ADBQRG4 clock driver and buffer from Texas Instruments. Crafted with precision and expertise, this product is designed to meet the highest quality standards and ensure seamless operation in a variety of applications. With its advanced features and innovative design, the CDCFR83ADBQRG4 delivers unmatched value and benefits to customers looking for a superior clocking solution. Trust Texas Instruments to provide you with the cutting-edge technology you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver, ensuring longevity and reliability.

Surface Mount: YES

Allows for easy and efficient installation on circuit boards, saving time and effort in the manufacturing process.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with common voltage levels used in electronic systems, making it versatile for a wide range of applications.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments where heat may be a factor.

Minimum Operating Temperature: -40 °C

Capable of operating in extremely cold conditions, ensuring reliability in various environmental settings.

Minimum fmax: 533 MHz

Offers high frequency capabilities, suitable for demanding clock signal requirements in advanced electronic systems.

Technical Specifications

Clock Drivers & Buffers CDCFR83ADBQRG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

CDCF

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.65 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Inverted Outputs:

1

No. of Terminals:

24

No. of True Outputs:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Minimum fmax:

533 MHz

Trade Compliance

CDCFR83ADBQRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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