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CDCDB800RSLR

Texas Instruments

CDCDB800RSLR by Texas Instruments

Texas Instruments CDCDB800RSLR is a clock driver with 3ns propagation delay at 3.3V, suitable for differential input conditioning. With 48 terminals in a square package, it operates b/w -40 to 105°C and supports up to 250MHz frequency applications.

Median Price

$4.540

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 14,578 parts In-Stock

1+ parts

$2.929

100+ parts

$2.567

1k+ parts

$1.450

10k+ parts

-

14,578

$2.929

$2.567

$1.450

-

Mouser Electronics

USA . 3,214 parts In-Stock

1+ parts

$4.540

100+ parts

$3.180

1k+ parts

-

10k+ parts

-

3,214

$4.540

$3.180

-

-

DigiKey

USA . 2,128 parts In-Stock

1+ parts

$4.540

100+ parts

$2.876

1k+ parts

$2.815

10k+ parts

$2.242

2,128

$4.540

$2.876

$2.815

$2.242

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,979 parts In-Stock

1+ parts

$1.810

100+ parts

-

1k+ parts

-

10k+ parts

-

3,979

$1.810

-

-

-

Digiode

USA . 1,609 parts In-Stock

1+ parts

$2.783

100+ parts

-

1k+ parts

-

10k+ parts

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1,609

$2.783

-

-

-

Chip Stock

USA . 19,500 parts In-Stock

1+ parts

-

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19,500

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-

-

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Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

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-

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3,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,091 parts In-Stock

1+ parts

$2.636

100+ parts

-

1k+ parts

-

10k+ parts

-

1,091

$2.636

-

-

-

Northwest PG Solutions

USA . 221 parts In-Stock

1+ parts

$2.795

100+ parts

-

1k+ parts

-

10k+ parts

-

221

$2.795

-

-

-

Andel Nordic

Denmark . 4,897 parts In-Stock

1+ parts

$7.298

100+ parts

-

1k+ parts

$7.006

10k+ parts

$7.006

4,897

$7.298

-

$7.006

$7.006

Parana Technologies

USA . 1,088 parts In-Stock

1+ parts

$21.023

100+ parts

-

1k+ parts

$21.252

10k+ parts

-

1,088

$21.023

-

$21.252

-

DigiPath Technology Company

USA . 1,978 parts In-Stock

1+ parts

$23.149

100+ parts

-

1k+ parts

-

10k+ parts

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1,978

$23.149

-

-

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ChromeModa Solutions

Germany . 3,662 parts In-Stock

1+ parts

$23.621

100+ parts

$19.369

1k+ parts

-

10k+ parts

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3,662

$23.621

$19.369

-

-

IDEA Electronic Components Group

UK . 1,656 parts In-Stock

1+ parts

$23.621

100+ parts

$22.440

1k+ parts

$21.259

10k+ parts

-

1,656

$23.621

$22.440

$21.259

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GreenTree Electronics

Israel . 10,000 parts In-Stock

1+ parts

-

100+ parts

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10,000

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-

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Lixinc

USA . 8,914 parts In-Stock

1+ parts

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8,914

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QUARKTWIN TECHNOLOGY LTD

USA . 8,766 parts In-Stock

1+ parts

-

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8,766

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-

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A-Z Elektronik GmbH

Germany . 4,000 parts In-Stock

1+ parts

-

100+ parts

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4,000

-

-

-

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Native Components

USA . 16 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.465

10k+ parts

-

16

-

-

$2.465

-

Overview

Unleash the power of precision timing with the CDCDB800RSLR by Texas Instruments, setting the standard for clock drivers and buffers. With a minimal propagation delay and high-quality manufacturing, this product is perfect for applications requiring differential input conditioning. Whether you're working on telecommunications, networking, or industrial automation projects, this chip carrier with a very thin profile offers exceptional value and reliability. Say goodbye to timing issues and hello to seamless performance with Texas Instruments' top-notch clock driver.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 3 ns

Low propagation delay ensures fast signal processing, making this clock driver a reliable choice for high-performance applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and simplifying manufacturing processes.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise and improving signal integrity, making this clock driver suitable for noise-sensitive applications.

Nominal Supply Voltage / Vsup: 3.3 V

Compatible with standard supply voltage requirements, ensuring easy integration into existing systems.

Maximum Operating Temperature: 105 °C

High maximum operating temperature allows for reliable operation in harsh environmental conditions, enhancing the product's durability.

Minimum Operating Temperature: -40 °C

Wide range of operating temperature ensures reliable performance in both extreme cold and hot conditions.

No. of True Outputs: 16

Multiple true outputs allow for driving multiple components simultaneously, making it suitable for complex circuit designs.

Technical Specifications

Clock Drivers & Buffers CDCDB800RSLR attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

CDC

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e4

Length:

6 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

48

No. of True Outputs:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.24SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

9 mA

Propagation Delay At Nominal Supply:

3 ns

Propagation Delay (tpd):

3 ns

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

6 mm

Minimum fmax:

250 MHz

Trade Compliance

CDCDB800RSLR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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