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CDCDB800RSLT

Texas Instruments

CDCDB800RSLT by Texas Instruments

The Texas Instruments CDCDB800RSLT clock driver has a 3ns propagation delay at 3.3V, with differential input conditioning and 16 true outputs. It operates b/w -40 to 105°C, in a square package style measuring 6x6mm, suitable for applications requiring precise clock distribution.

Median Price

$4.460

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 1,876 parts In-Stock

1+ parts

$4.460

100+ parts

$3.908

1k+ parts

$2.208

10k+ parts

-

1,876

$4.460

$3.908

$2.208

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,164 parts In-Stock

1+ parts

$4.237

100+ parts

-

1k+ parts

-

10k+ parts

-

1,164

$4.237

-

-

-

Vyrian

USA . 2,311 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,311

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 4,707 parts In-Stock

1+ parts

$3.389

100+ parts

-

1k+ parts

$3.254

10k+ parts

$3.254

4,707

$3.389

-

$3.254

$3.254

Northwest PG Solutions

USA . 727 parts In-Stock

1+ parts

$3.401

100+ parts

-

1k+ parts

-

10k+ parts

-

727

$3.401

-

-

-

Corphita

USA . 103 parts In-Stock

1+ parts

$4.014

100+ parts

-

1k+ parts

-

10k+ parts

-

103

$4.014

-

-

-

Parana Technologies

USA . 1,285 parts In-Stock

1+ parts

$12.374

100+ parts

-

1k+ parts

$12.811

10k+ parts

-

1,285

$12.374

-

$12.811

-

DigiPath Technology Company

USA . 246 parts In-Stock

1+ parts

$13.625

100+ parts

-

1k+ parts

-

10k+ parts

-

246

$13.625

-

-

-

ChromeModa Solutions

Germany . 5,153 parts In-Stock

1+ parts

$13.903

100+ parts

$11.400

1k+ parts

-

10k+ parts

-

5,153

$13.903

$11.400

-

-

IDEA Electronic Components Group

UK . 1,493 parts In-Stock

1+ parts

$13.903

100+ parts

$13.208

1k+ parts

$12.513

10k+ parts

-

1,493

$13.903

$13.208

$12.513

-

AZTECH Wire

Italy . 510 parts In-Stock

1+ parts

$15.090

100+ parts

-

1k+ parts

-

10k+ parts

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510

$15.090

-

-

-

Native Components

USA . 115 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.999

10k+ parts

-

115

-

-

$2.999

-

Overview

Experience unparalleled performance with the CDCDB800RSLT from Texas Instruments, a leading manufacturer in clock drivers & buffers. This innovative product offers a propagation delay of just 3ns, ensuring precision timing in your applications. Ideal for use in high-speed data communication systems, this chip carrier boasts a compact design and operates seamlessly at temperatures ranging from -40°C to 105°C. Elevate your projects with the reliability and efficiency that Texas Instruments is known for, and achieve optimal results with the CDCDB800RSLT.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 3 ns

Low propagation delay ensures efficient signal transmission and synchronization.

Surface Mount: YES

Makes it easy to integrate into circuit boards, saving space and simplifying assembly.

Input Conditioning: DIFFERENTIAL

Allows for reliable data transmission by reducing noise and interference.

Package Shape: SQUARE

Square shape provides a compact design and efficient use of space.

Nominal Supply Voltage / Vsup (V): 3.3

Suitable for a wide range of applications that require a 3.3V power supply.

No. of Terminals: 48

Provides ample connection options for various inputs and outputs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Versatile package options for different thermal and space requirements.

Maximum Operating Temperature: 105 °C

Can withstand high temperatures, ensuring reliability in challenging conditions.

Minimum Operating Temperature: -40 °C

Operational in a wide range of temperatures, suitable for varying environments.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish for durability and corrosion resistance.

No. of True Outputs: 16

Provides multiple output options for connecting to various components.

Minimum fmax: 250 MHz

High maximum frequency allows for fast data processing and high-speed operations.

Maximum Supply Voltage (Vsup): 3.6 V

Can handle a higher supply voltage for added flexibility in power sources.

Technical Specifications

Clock Drivers & Buffers CDCDB800RSLT attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

CDC

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e4

Length:

6 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

48

No. of True Outputs:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.24SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

9 mA

Propagation Delay At Nominal Supply:

3 ns

Propagation Delay (tpd):

3 ns

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

6 mm

Minimum fmax:

250 MHz

Trade Compliance

CDCDB800RSLT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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