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CDCDB803RSLT

Texas Instruments

CDCDB803RSLT by Texas Instruments

CDCDB803RSLT by Texas Instruments is a clock driver with 3ns propagation delay, suitable for industrial applications. It operates at 3.3V with 48 terminals in a square package style. With differential input conditioning and peak reflow temperature of 260°C, it offers high performance in a compact form factor.

Median Price

$4.460

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 48,250 parts In-Stock

1+ parts

$4.460

100+ parts

$3.908

1k+ parts

$2.208

10k+ parts

-

48,250

$4.460

$3.908

$2.208

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,181 parts In-Stock

1+ parts

$4.237

100+ parts

-

1k+ parts

-

10k+ parts

-

1,181

$4.237

-

-

-

Vyrian

USA . 3,025 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,025

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 651 parts In-Stock

1+ parts

$2.070

100+ parts

-

1k+ parts

-

10k+ parts

-

651

$2.070

-

-

-

Northwest PG Solutions

USA . 1,556 parts In-Stock

1+ parts

$2.277

100+ parts

-

1k+ parts

-

10k+ parts

-

1,556

$2.277

-

-

-

Corphita

USA . 2,204 parts In-Stock

1+ parts

$4.014

100+ parts

-

1k+ parts

-

10k+ parts

-

2,204

$4.014

-

-

-

Andel Nordic

Denmark . 895 parts In-Stock

1+ parts

$6.241

100+ parts

-

1k+ parts

$5.992

10k+ parts

$5.992

895

$6.241

-

$5.992

$5.992

AZTECH Wire

Italy . 1,083 parts In-Stock

1+ parts

$12.530

100+ parts

-

1k+ parts

-

10k+ parts

-

1,083

$12.530

-

-

-

Parana Technologies

USA . 2,231 parts In-Stock

1+ parts

$13.735

100+ parts

$1,275.537

1k+ parts

$12.362

10k+ parts

-

2,231

$13.735

$1,275.537

$12.362

-

DigiPath Technology Company

USA . 1,609 parts In-Stock

1+ parts

$15.124

100+ parts

$13.914

1k+ parts

-

10k+ parts

-

1,609

$15.124

$13.914

-

-

ChromeModa Solutions

Germany . 6,614 parts In-Stock

1+ parts

$15.433

100+ parts

$12.655

1k+ parts

-

10k+ parts

-

6,614

$15.433

$12.655

-

-

IDEA Electronic Components Group

UK . 288 parts In-Stock

1+ parts

$15.433

100+ parts

$14.661

1k+ parts

$13.890

10k+ parts

-

288

$15.433

$14.661

$13.890

-

Overview

Enhance your electronic designs with the CDCDB803RSLT clock driver & buffer from Texas Instruments. Known for their high-quality products, Texas Instruments delivers reliable solutions for a wide range of applications. With a fast propagation delay of 3 ns and a wide operating temperature range, this chip carrier package offers exceptional performance in industrial settings. Say goodbye to timing issues and ensure precise synchronization with the CDCDB803RSLT. Trust Texas Instruments to provide innovative technology that meets your design needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and helps in preventing damage to the internal components.

Propagation Delay At Nominal Supply: 3 ns

Low propagation delay ensures quick signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy and efficient installation on circuit boards.

Input Conditioning: DIFFERENTIAL

Differential input conditioning helps in reducing noise and improving signal integrity, making this product ideal for critical applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operates efficiently at a nominal supply voltage of 3.3V, making it compatible with a wide range of systems.

No. of Terminals: 48

The high number of terminals allows for connection to multiple input and output devices, increasing versatility and functionality.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles helps in efficient heat dissipation and space-saving design.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature ensures reliable performance even in challenging environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows for use in a wide range of temperature environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel, palladium, and gold terminal finish provides high conductivity, corrosion resistance, and ensures long-term reliability.

Terminal Position: QUAD

Quad terminal position facilitates easy and secure connection to the circuit board.

Maximum Seated Height: 1 mm

Low seated height allows for compact and space-efficient design implementation.

Width: 6 mm

The compact width of 6mm saves space on the PCB, making it suitable for densely populated boards.

Minimum Supply Voltage (Vsup): 3 V

The low minimum supply voltage requirement of 3V ensures compatibility with a wide range of power sources.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance of 260°C enables the product to withstand the soldering process during assembly.

Length: 6 mm

The compact length of 6mm contributes to space-saving design and allows for flexibility in placement on the PCB.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in harsh industrial environments.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and fast operation, making it suitable for advanced applications.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations and is safe for use in various applications.

Packing Method: TR

TR packing method provides secure handling and storage of the product during transportation and assembly processes.

Terminal Pitch: 0.4 mm

The small terminal pitch of 0.4mm allows for high-density mounting on the PCB, increasing integration possibilities.

Maximum Same Edge Skew (tskwd): 0.05 ns

Low same edge skew ensures minimal signal distortion and accurate data transmission.

No. of True Outputs: 16

The presence of 16 true outputs offers flexibility in signal distribution and processing, enhancing the functionality of the product.

Minimum fmax: 250 MHz

High minimum fmax of 250MHz allows for fast data processing and signal transmission, making it suitable for high-performance applications.

Maximum Supply Voltage (Vsup): 3.6 V

The maximum supply voltage of 3.6V provides operating margin and protection against voltage spikes, ensuring the longevity of the product.

Maximum Power Supply Current (ICC): 9 mA

Low power supply current consumption of 9mA helps in reducing overall power consumption and heat generation, leading to energy-efficient operation.

Technical Specifications

Clock Drivers & Buffers CDCDB803RSLT attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

CDC

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

6 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

48

No. of True Outputs:

16

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.24SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

9 mA

Propagation Delay At Nominal Supply:

3 ns

Propagation Delay (tpd):

3 ns

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Width:

6 mm

Minimum fmax:

250 MHz

Trade Compliance

CDCDB803RSLT Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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