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CDCDB400RHBR

Texas Instruments

CDCDB400RHBR by Texas Instruments

Texas Instruments CDCDB400RHBR clock driver has 3 ns propagation delay, operates at -40 to 105 °C, and supports 8 true outputs. Ideal for applications requiring differential input conditioning and a nominal voltage of 3.3 V. Package style is chip carrier with very thin profile, suitable for surface mount assembly.

Median Price

$3.270

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 14,517 parts In-Stock

1+ parts

$2.222

100+ parts

$1.947

1k+ parts

$1.100

10k+ parts

-

14,517

$2.222

$1.947

$1.100

-

Mouser Electronics

USA . 2,859 parts In-Stock

1+ parts

$3.270

100+ parts

$2.030

1k+ parts

$1.810

10k+ parts

$1.730

2,859

$3.270

$2.030

$1.810

$1.730

DigiKey

USA . 2,716 parts In-Stock

1+ parts

$3.270

100+ parts

$2.027

1k+ parts

$1.802

10k+ parts

$1.723

2,716

$3.270

$2.027

$1.802

$1.723

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,383 parts In-Stock

1+ parts

$2.111

100+ parts

-

1k+ parts

-

10k+ parts

-

1,383

$2.111

-

-

-

Vyrian

USA . 1,399 parts In-Stock

1+ parts

$2.222

100+ parts

-

1k+ parts

-

10k+ parts

-

1,399

$2.222

-

-

-

Sensible Micro Corp

USA . 5 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 787 parts In-Stock

1+ parts

$1.760

100+ parts

-

1k+ parts

-

10k+ parts

-

787

$1.760

-

-

-

Northwest PG Solutions

USA . 909 parts In-Stock

1+ parts

$1.936

100+ parts

-

1k+ parts

-

10k+ parts

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909

$1.936

-

-

-

Corphita

USA . 2,333 parts In-Stock

1+ parts

$2.000

100+ parts

-

1k+ parts

-

10k+ parts

-

2,333

$2.000

-

-

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Component Stockers USA

USA . 65,854 parts In-Stock

1+ parts

$3.160

100+ parts

$2.330

1k+ parts

$1.170

10k+ parts

$1.170

65,854

$3.160

$2.330

$1.170

$1.170

Andel Nordic

Denmark . 1,354 parts In-Stock

1+ parts

$7.482

100+ parts

-

1k+ parts

$7.183

10k+ parts

$7.183

1,354

$7.482

-

$7.183

$7.183

Parana Technologies

USA . 228 parts In-Stock

1+ parts

$13.969

100+ parts

-

1k+ parts

$14.442

10k+ parts

-

228

$13.969

-

$14.442

-

DigiPath Technology Company

USA . 2,354 parts In-Stock

1+ parts

$15.381

100+ parts

$14.151

1k+ parts

-

10k+ parts

-

2,354

$15.381

$14.151

-

-

ChromeModa Solutions

Germany . 6,103 parts In-Stock

1+ parts

$15.695

100+ parts

$12.870

1k+ parts

-

10k+ parts

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6,103

$15.695

$12.870

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IDEA Electronic Components Group

UK . 2,091 parts In-Stock

1+ parts

$15.695

100+ parts

$14.910

1k+ parts

$14.126

10k+ parts

-

2,091

$15.695

$14.910

$14.126

-

GreenTree Electronics

Israel . 10,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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10,000

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Overview

Enhance your electronic designs with the CDCDB400RHBR by Texas Instruments, a high-quality clock driver and buffer that offers reliability and precision. Manufactured by a trusted industry leader, this product provides exceptional performance in various applications. With its fast propagation delay and differential input conditioning, this chip carrier with a very thin profile is perfect for demanding projects. Experience the benefits of its 3-state output characteristics and wide operating temperature range, ensuring optimal functionality in any environment. Upgrade your technology with the CDCDB400RHBR and unlock new possibilities in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 3 ns

Low propagation delay ensures quick signal transmission, making this product suitable for high-speed applications requiring precise timing.

Surface Mount: YES

Easy integration onto circuit boards, saving space and allowing for efficient design layouts.

Input Conditioning: DIFFERENTIAL

Enhances noise immunity and signal integrity, ensuring accurate data transmission in challenging environments.

Nominal Supply Voltage / Vsup (V): 3.3

Operates within standard voltage levels, making it compatible with a wide range of existing systems.

No. of Terminals: 32

Provides flexibility for connecting to other components and peripherals in a system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Offers multiple packaging options for different application requirements, including heat dissipation and space constraints.

Output Characteristics: 3-STATE WITH SERIES RESISTOR

Enables tri-state outputs for bus sharing and minimizes signal reflections with the series resistor.

Minimum Operating Temperature: -40 °C

Can operate in harsh environments with low temperatures, expanding the product's usability in various applications.

Maximum Operating Temperature: 105 °C

Can withstand high operating temperatures, ensuring reliability even in challenging thermal conditions.

Technical Specifications

Clock Drivers & Buffers CDCDB400RHBR attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

CDC

Input Conditioning:

DIFFERENTIAL

JESD-30 Code:

S-PQCC-N32

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

32

No. of True Outputs:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC32,.2SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Packing Method:

TE, 13 INCH

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

46 mA

Propagation Delay At Nominal Supply:

3 ns

Propagation Delay (tpd):

3 ns

Maximum Same Edge Skew (tskwd):

.05 ns

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Minimum fmax:

250 MHz

Trade Compliance

CDCDB400RHBR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

Category top products 20

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