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CDC351DBRG4

Texas Instruments

CDC351DBRG4 by Texas Instruments

CDC351DBRG4 clock driver by Texas Instruments features 4.2ns propagation delay, 3.3V nominal voltage, and 50pF load capacitance. Ideal for applications requiring precise timing control in commercial-grade environments with a temperature range of 0-70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,520 parts In-Stock

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Digiode

USA . 1,387 parts In-Stock

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1,387

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 138 parts In-Stock

1+ parts

$1.280

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-

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138

$1.280

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Northwest PG Solutions

USA . 229 parts In-Stock

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$1.408

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229

$1.408

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Andel Nordic

Denmark . 4,718 parts In-Stock

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$2.795

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-

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$2.683

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$2.683

4,718

$2.795

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$2.683

$2.683

AZTECH Wire

Italy . 387 parts In-Stock

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$8.752

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387

$8.752

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Parana Technologies

USA . 1,173 parts In-Stock

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$30.188

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$2,803.405

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$27.169

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$30.188

$2,803.405

$27.169

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DigiPath Technology Company

USA . 2,346 parts In-Stock

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$33.241

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$33.241

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ChromeModa Solutions

Germany . 2,980 parts In-Stock

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$33.919

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$27.814

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$33.919

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IDEA Electronic Components Group

UK . 823 parts In-Stock

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$33.919

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$32.223

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$30.527

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823

$33.919

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$30.527

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One Stop Electronics

USA . 1,308 parts In-Stock

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$52.000

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QUARKTWIN TECHNOLOGY LTD

USA . 10,250 parts In-Stock

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Kepictronics

USA . 7,730 parts In-Stock

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Corphita

USA . 2,773 parts In-Stock

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Microchip USA

USA . 2,636 parts In-Stock

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Overview

Enhance your electronic designs with the CDC351DBRG4 clock driver by Texas Instruments. Crafted with precision and expertise, this high-quality component offers a seamless synchronization for your applications in the Clock Drivers & Buffers category. Experience reliable performance, fast propagation delay, and versatile input conditioning. With a compact design and advanced technology, this product ensures optimal functionality and efficiency, making it a valuable investment for your projects. Upgrade your systems with the CDC351DBRG4 and unlock a world of possibilities in the realm of electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ensuring reliability and longevity.

Propagation Delay At Nominal Supply: 4.2 ns

Low propagation delay ensures fast signal transmission, making this product suitable for time-sensitive applications.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with a common supply voltage of 3.3V, making integration into existing systems straightforward.

Load Capacitance (CL): 50 pF

Adjustable load capacitance allows for customization based on specific application requirements.

Maximum I (ol): 32 Amp

High maximum output current capability enables driving of multiple loads without external amplification.

Output Characteristics: 3-STATE

3-state output allows for efficient control and management of signals, enhancing overall system performance.

Technology: BICMOS

Utilization of BiCMOS technology offers the benefits of both bipolar and CMOS technologies, providing high performance and low power consumption.

Technical Specifications

Clock Drivers & Buffers CDC351DBRG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

351

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

32 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

24

No. of True Outputs:

10

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

25 mA

Propagation Delay At Nominal Supply:

4.2 ns

Propagation Delay (tpd):

4.2 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.8 ns

Maximum Seated Height:

2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Minimum fmax:

100 MHz

Trade Compliance

CDC351DBRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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