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CDC319DBRG4

Texas Instruments

CDC319DBRG4 by Texas Instruments

CDC319DBRG4 clock driver by Texas Instruments has a propagation delay of 150ns, operates at 3.3V, and offers 10 true outputs. It is used in applications requiring precise timing control and signal buffering, with a package style of small outline shrink pitch for compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,891 parts In-Stock

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Digiode

USA . 4,644 parts In-Stock

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Native Components

USA . 79 parts In-Stock

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$0.733

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79

$0.733

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Northwest PG Solutions

USA . 1,585 parts In-Stock

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$0.806

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$0.806

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AZTECH Wire

Italy . 490 parts In-Stock

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$8.851

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490

$8.851

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Parana Technologies

USA . 1,841 parts In-Stock

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$19.284

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$19.313

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1,841

$19.284

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$19.313

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DigiPath Technology Company

USA . 1,781 parts In-Stock

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$21.234

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1,781

$21.234

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ChromeModa Solutions

Germany . 4,445 parts In-Stock

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$21.667

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$17.767

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$21.667

$17.767

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IDEA Electronic Components Group

UK . 2,075 parts In-Stock

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$21.667

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$20.584

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$19.500

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$21.667

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Ampacity Inc.

Singapore . 377 parts In-Stock

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$48.000

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One Stop Electronics

USA . 1,236 parts In-Stock

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$57.000

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A-Z Elektronik GmbH

Germany . 7,142 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,761 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Corphita

USA . 2,714 parts In-Stock

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Microchip USA

USA . 2,480 parts In-Stock

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Overview

Unlock the power of precise timing with the CDC319DBRG4 clock driver by Texas Instruments. Designed with top-notch quality and reliability, this product is perfect for a wide range of applications in the Clock Drivers & Buffers category. With its fast propagation delay and 3-STATE output characteristics, this small outline package offers customers unmatched performance and efficiency. Trust Texas Instruments to deliver cutting-edge technology that meets your needs while providing exceptional value and benefits. Elevate your projects with the CDC319DBRG4 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the clock driver, ensuring long-term reliability.

Propagation Delay At Nominal Supply: 150 ns

Fast propagation delay ensures efficient data transfer and synchronization in the clock distribution system.

Surface Mount: YES

Allows for easy and efficient PCB assembly, saving time and cost during production.

Input Conditioning: STANDARD

Ensures compatibility with a wide range of input signals, making the clock driver versatile for different applications.

Nominal Supply Voltage / Vsup (V): 3.3

Compatible with common supply voltages used in electronic systems, making integration easier.

Load Capacitance (CL): 400 pF

Suitable for driving a variety of loads, ensuring flexibility in system design.

Power Supplies (V): 3.3

Uses a standard supply voltage, reducing the need for additional power regulation components in the system.

No. of Terminals: 28

Provides ample connectivity options for interfacing with other components in the system.

Maximum I (ol): 6 Amp

Ability to drive high current loads, making it suitable for demanding applications.

Propagation Delay (tpd): 3.6 ns

Low propagation delay ensures minimal signal distortion and accurate clock distribution.

Maximum Operating Temperature: 70 °C

Can operate reliably in a wide range of temperature conditions, suitable for various environments.

Output Characteristics: 3-STATE

The 3-state output allows for high impedance when not actively driving the signal line, reducing interference in the system.

Width: 5.3 mm

Compact size allows for space-efficient placement on the PCB.

Minimum Supply Voltage (Vsup): 3.135 V

Ensures reliable operation even when the supply voltage fluctuates slightly.

Temperature Grade: COMMERCIAL

Suitable for standard commercial applications with moderate temperature requirements.

Technology: BICMOS

Utilizes BiCMOS technology for efficient power consumption and high-speed operation.

Technical Specifications

Clock Drivers & Buffers CDC319DBRG4 attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

319

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

10.2 mm

Load Capacitance (CL):

400 pF

Logic IC Type:

Maximum I (ol):

6 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

28

No. of True Outputs:

10

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP28,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

.5 mA

Propagation Delay At Nominal Supply:

150 ns

Propagation Delay (tpd):

3.6 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

.25 ns

Maximum Seated Height:

2 mm

Sub-Category:

Clock Driver

Maximum Supply Voltage (Vsup):

3.465 V

Minimum Supply Voltage (Vsup):

3.135 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Minimum fmax:

100 MHz

Trade Compliance

CDC319DBRG4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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