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CDC2351QDBR

Texas Instruments

CDC2351QDBR by Texas Instruments

Texas Instruments CDC2351QDBR is clock driver with 11ns propagation delay, 3.3V supply voltage, and 50pF load capacitance. Ideal for automotive applications due to BICMOS technology, it offers 10 true outputs and operates b/w -40°C to 125°C temperature range.

Median Price

$9.919

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 15,582 parts In-Stock

1+ parts

$9.919

100+ parts

$8.664

1k+ parts

$5.975

10k+ parts

-

15,582

$9.919

$8.664

$5.975

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,809 parts In-Stock

1+ parts

$9.423

100+ parts

-

1k+ parts

-

10k+ parts

-

2,809

$9.423

-

-

-

Vyrian

USA . 2,091 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,091

-

-

-

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Holdelec - ElecDif-Pro

France . 1,380 parts In-Stock

1+ parts

-

100+ parts

-

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1,380

-

-

-

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ACDS - Activité Composants Distribution Service

France . 1,350 parts In-Stock

1+ parts

-

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-

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1,350

-

-

-

-

Component Sense

UK . 1,005 parts In-Stock

1+ parts

-

100+ parts

-

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1,005

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 485 parts In-Stock

1+ parts

$1.230

100+ parts

-

1k+ parts

-

10k+ parts

-

485

$1.230

-

-

-

Northwest PG Solutions

USA . 47 parts In-Stock

1+ parts

$1.353

100+ parts

-

1k+ parts

-

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47

$1.353

-

-

-

Andel Nordic

Denmark . 882 parts In-Stock

1+ parts

$7.778

100+ parts

-

1k+ parts

$7.467

10k+ parts

$7.467

882

$7.778

-

$7.467

$7.467

Ampacity Inc.

Singapore . 15,287 parts In-Stock

1+ parts

$8.430

100+ parts

-

1k+ parts

-

10k+ parts

-

15,287

$8.430

-

-

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Corphita

USA . 2,320 parts In-Stock

1+ parts

$8.927

100+ parts

-

1k+ parts

-

10k+ parts

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2,320

$8.927

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-

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AZTECH Wire

Italy . 459 parts In-Stock

1+ parts

$11.250

100+ parts

-

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459

$11.250

-

-

-

Parana Technologies

USA . 2,038 parts In-Stock

1+ parts

$26.113

100+ parts

-

1k+ parts

$26.699

10k+ parts

-

2,038

$26.113

-

$26.699

-

DigiPath Technology Company

USA . 1,123 parts In-Stock

1+ parts

$28.754

100+ parts

-

1k+ parts

-

10k+ parts

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1,123

$28.754

-

-

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ChromeModa Solutions

Germany . 3,681 parts In-Stock

1+ parts

$29.341

100+ parts

$24.060

1k+ parts

-

10k+ parts

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3,681

$29.341

$24.060

-

-

IDEA Electronic Components Group

UK . 1,779 parts In-Stock

1+ parts

$29.341

100+ parts

$27.874

1k+ parts

$26.407

10k+ parts

-

1,779

$29.341

$27.874

$26.407

-

Component Stockers USA

USA . 11,599 parts In-Stock

1+ parts

-

100+ parts

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11,599

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Lixinc

USA . 10,871 parts In-Stock

1+ parts

-

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10,871

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A-Z Elektronik GmbH

Germany . 5,543 parts In-Stock

1+ parts

-

100+ parts

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5,543

-

-

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

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4,000

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-

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Alle Elektronik GmbH

Germany . 3,695 parts In-Stock

1+ parts

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3,695

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-

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Kepictronics

USA . 42 parts In-Stock

1+ parts

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42

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-

Overview

Enhance your electronic designs with the Texas Instruments CDC2351QDBR Clock Driver & Buffer. With a reputation for high-quality components, Texas Instruments delivers reliable performance in a variety of applications. This clock driver offers customers value through its fast propagation delay, small outline package style, and automotive-grade temperature rating. Elevate your projects with the precision and efficiency that Texas Instruments is known for, setting your designs apart from the rest.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the clock driver, ensuring long-term reliability.

Propogation Delay at Nominal Supply: 11 ns

The low propagation delay ensures fast signal transmission, making this clock driver suitable for high-speed applications.

Surface Mount: YES

The surface mount design allows for easy installation on circuit boards, saving space and simplifying the assembly process.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V supply voltage is common in many electronic devices, making this clock driver compatible with a wide range of applications.

Maximum Power Supply Current (ICC): 15 mA

The low power consumption of this clock driver helps reduce energy costs and is ideal for battery-powered devices.

Technical Specifications

Clock Drivers & Buffers CDC2351QDBR attributes and parameters. Explore more Clock Drivers & Buffers devices from Texas Instruments

Specs

Family:

2351

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

8.2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

12 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inverted Outputs:

0

No. of Terminals:

24

No. of True Outputs:

10

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP24,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

15 mA

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

11 ns

Qualification:

Not Qualified

Maximum Same Edge Skew (tskwd):

2.5 ns

Maximum Seated Height:

2 mm

Sub-Category:

Clock Drivers

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5.3 mm

Minimum fmax:

100 MHz

Trade Compliance

CDC2351QDBR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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