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CD54ACT139F3A

Texas Instruments

CD54ACT139F3A by Texas Instruments

CD54ACT139F3A by Texas Instruments is a CMOS Decoder & Drivers with 2 functions, 10.5 ns propagation delay, and 5V nominal voltage. Ideal for military applications due to its MIL-STD screening level and operating temperature range of -55°C to 125°C. Package style is in-line with through-hole terminal form.

Median Price

$11.645

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 62 parts In-Stock

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$12.230

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$11.500

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$10.400

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$12.230

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$10.400

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DigiKey

USA . 62 parts In-Stock

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$11.060

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Freelance Electronics

USA . 5 parts In-Stock

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$5.808

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Bristol Electronics

USA . 8 parts In-Stock

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$8.960

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Digiode

USA . 3,183 parts In-Stock

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$11.618

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Vyrian

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Electronic Expediters

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Microfarads

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Resion

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Native Components

USA . 169 parts In-Stock

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$0.236

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$0.227

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Northwest PG Solutions

USA . 1,260 parts In-Stock

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$0.260

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Corphita

USA . 663 parts In-Stock

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$11.007

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Parana Technologies

USA . 646 parts In-Stock

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DigiPath Technology Company

USA . 1,354 parts In-Stock

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$23.375

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$21.505

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ChromeModa Solutions

Germany . 3,567 parts In-Stock

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IDEA Electronic Components Group

UK . 1,928 parts In-Stock

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Microchip USA

USA . 1,274 parts In-Stock

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$31.780

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$31.330

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$31.100

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QUARKTWIN TECHNOLOGY LTD

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Supply Digital

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Metaverse IC Inc.

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Kepictronics

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Assy Fe

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Overview

Enhance your electronics projects with the superior quality and reliability of the Texas Instruments CD54ACT139F3A decoder and driver. Crafted from top-notch ceramic and glass-sealed materials, this component boasts a quick propagation delay of 10.5 ns, making it ideal for applications requiring fast response times. With a MILITARY-grade temperature rating and 16 terminals for versatile connectivity, this decoder offers unmatched value and performance. Trust in Texas Instruments to deliver cutting-edge technology that elevates your designs to new heights.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed material ensures durability and reliability, making this product suitable for various applications

Propagation Delay At Nominal Supply: 10.5 ns

Fast propagation delay at nominal supply voltage results in quick response times and efficient operation

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage of 5V, making it compatible with many systems and easy to integrate

Maximum Operating Temperature: 125 °C

Capable of operating at high temperatures, ensuring reliability in harsh environments

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable

Technical Specifications

Decoder & Drivers CD54ACT139F3A attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

2 ENABLE INPUTS

Family:

ACT

Input Conditioning:

STANDARD

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

.08 mA

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

11.5 ns

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

5.08 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

CD54ACT139F3A Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-350-7937, 5962013507937

NIIN

013507937

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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