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CD54HC139F3A

Texas Instruments

CD54HC139F3A by Texas Instruments

CD54HC139F3A by Texas Instruments is a CMOS Decoder & Drivers with 2 functions, 4-bit input, and 36ns propagation delay. Ideal for military applications due to its MIL-Grade temperature range of -55 to 125 °C and glass-sealed ceramic package. Operates at supply voltages b/w 2-6V with inverted output polarity.

Median Price

$10.989

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Freelance Electronics

USA . 73 parts In-Stock

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$10.989

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$11.538

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Vyrian

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Digiode

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Corel Iberica Componentes, S.L.

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Northwest PG Solutions

USA . 1,351 parts In-Stock

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One Stop Electronics

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AZTECH Wire

Italy . 264 parts In-Stock

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$10.557

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Parana Technologies

USA . 184 parts In-Stock

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DigiPath Technology Company

USA . 1,661 parts In-Stock

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ChromeModa Solutions

Germany . 2,841 parts In-Stock

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IDEA Electronic Components Group

UK . 1,208 parts In-Stock

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Lixinc

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Native Components

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Overview

Unlock the power of seamless decoding and driving with the Texas Instruments CD54HC139F3A. Crafted with precision from high-quality ceramic and glass-sealed materials, this decoder and driver duo boasts unparalleled reliability and efficiency. Perfect for a wide range of applications, this product offers customers the value of fast propagation delay, inverted output polarity, and a wide operating temperature range. Say goodbye to compatibility issues and hello to superior performance with Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Ceramic and glass-sealed package provides excellent protection and reliability, making this product suitable for harsh environmental conditions.

Propagation Delay At Nominal Supply: 36 ns

Low propagation delay ensures fast signal processing and efficient operation of the decoder.

No. of Functions: 2

Having multiple functions in a single device helps in simplifying the circuit design and reducing overall component count.

Nominal Supply Voltage / Vsup (V): 4.5

Operates at a standard supply voltage, making it compatible with a wide range of applications.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows the decoder to function reliably in extreme heat conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the decoder energy efficient and reliable.

Technical Specifications

Decoder & Drivers CD54HC139F3A attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

HC

Input Conditioning:

STANDARD

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

No. of Bits:

4

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

36 ns

Propagation Delay (tpd):

220 ns

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

5.08 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

CD54HC139F3A Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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