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CD54AC139F3A

Texas Instruments

CD54AC139F3A by Texas Instruments

CD54AC139F3A by Texas Instruments is a CMOS Decoder & Drivers with 2 functions, 4 bits, and 16 terminals. It has a propagation delay of 14.7 ns at 3.3V supply voltage, suitable for military-grade applications requiring fast signal decoding and driving capabilities within the temperature range of -55 to 125°C.

Median Price

$15.563

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 198 parts In-Stock

1+ parts

-

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$12.450

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$11.140

10k+ parts

$10.490

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$12.450

$11.140

$10.490

DigiKey

USA . 198 parts In-Stock

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-

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$16.390

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$16.390

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Verical

USA . 198 parts In-Stock

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$15.563

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$13.925

10k+ parts

$13.113

198

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$15.563

$13.925

$13.113

Distributors (In-Stock)

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Digiode

USA . 2,198 parts In-Stock

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$11.438

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Vyrian

USA . 6,903 parts In-Stock

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Odi Ramu Company

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DigiKey Marketplace

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Resion

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PC Components Company LLC

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Bristol Electronics

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Distributors (Availability)

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Native Components

USA . 142 parts In-Stock

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$1.138

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Northwest PG Solutions

USA . 1,473 parts In-Stock

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Corphita

USA . 4,642 parts In-Stock

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$10.836

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Parana Technologies

USA . 2,349 parts In-Stock

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$18.354

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$18.481

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DigiPath Technology Company

USA . 950 parts In-Stock

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$20.210

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$18.593

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ChromeModa Solutions

Germany . 3,524 parts In-Stock

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$20.622

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$16.910

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IDEA Electronic Components Group

UK . 1,112 parts In-Stock

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$19.591

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$18.560

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Supply Digital

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Microchip USA

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Assy Fe

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Overview

Experience superior quality and reliability with the CD54AC139F3A by Texas Instruments, a leading manufacturer in the industry. This decoder & driver chip offers unmatched performance and efficiency, making it ideal for a wide range of applications. With its advanced technology and military-grade temperature grade, this product ensures optimal functionality even in the most demanding conditions. Trust Texas Instruments to deliver exceptional value and benefits to customers, setting new standards in the realm of electronic components.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and reliability for the product, ensuring it can withstand harsh environmental conditions.

Propagation Delay At Nominal Supply: 14.7 ns

Fast propagation delay ensures quick response time for processing signals, making the product efficient.

Input Conditioning: STANDARD

Standard input conditioning allows for easy compatibility with various input signals, offering versatility in usage.

No. of Functions: 2

Having multiple functions in a single product allows for efficient circuit design and space-saving, making it a cost-effective choice.

Screening Level: 38535Q/M;38534H;883B

High screening level ensures reliability and quality, making the product suitable for critical applications.

Package Shape: RECTANGULAR

Rectangular package shape is space-efficient and easy to integrate into various circuit layouts.

No. of Bits: 4

Having 4 bits provides sufficient processing capability for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 3.3

Stable supply voltage of 3.3V ensures consistent performance of the product.

Load Capacitance (CL): 50 pF

Suitable load capacitance ensures optimal signal transmission and reception in the circuit.

Power Supplies (V): 3.3/5

Supports dual power supply options, providing flexibility in voltage selection based on application requirements.

No. of Terminals: 16

Sufficient terminals allow for easy connectivity and integration into circuit designs.

Width: 7.62 mm

Compact width design saves space and allows for dense packing of components in a circuit.

Output Polarity: INVERTED

Inverted output polarity can be beneficial for certain applications requiring complementary logic operations.

Temperature Grade: MILITARY

Military-grade temperature rating ensures reliable operation in extreme temperature conditions, suitable for defense and aerospace applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable.

Technical Specifications

Decoder & Drivers CD54AC139F3A attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Family:

AC

Input Conditioning:

STANDARD

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

No. of Bits:

4

No. of Functions:

2

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

14.7 ns

Propagation Delay (tpd):

131 ns

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

5.08 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

CD54AC139F3A Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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