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CD54HC237F3A

Texas Instruments

CD54HC237F3A by Texas Instruments

CD54HC237F3A by Texas Instruments is an 8-bit decoder with 36ns propagation delay, latch input conditioning, and 50pF load capacitance. Ideal for military applications, it operates b/w -55 to 125°C with a supply voltage range of 2-6V.

Median Price

$16.370

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 587 parts In-Stock

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Vyrian

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Digiode

USA . 1,649 parts In-Stock

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ACDS - Activité Composants Distribution Service

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Holdelec - ElecDif-Pro

France . 44 parts In-Stock

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Native Components

USA . 184 parts In-Stock

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$0.060

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Northwest PG Solutions

USA . 113 parts In-Stock

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$0.069

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Parana Technologies

USA . 813 parts In-Stock

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$27.827

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$40.430

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DigiPath Technology Company

USA . 1,659 parts In-Stock

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$30.641

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IDEA Electronic Components Group

UK . 1,692 parts In-Stock

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$31.266

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$29.703

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$28.139

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ChromeModa Solutions

Germany . 1,635 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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Supply Digital

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Corphita

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Microchip USA

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Overview

Unlock the power of precision with Texas Instruments' CD54HC237F3A Decoder & Drivers. This top-notch product boasts unparalleled quality and reliability, making it a standout choice for a wide range of applications. From industrial automation to automotive systems, this versatile component provides exceptional performance and efficiency. Experience the value and benefits of Texas Instruments technology with the CD54HC237F3A, where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides durability and protection, making the product suitable for harsh environments.

Propagation Delay At Nominal Supply: 36 ns

The low propagation delay ensures fast response times, making the product efficient for time-critical applications.

Input Conditioning: LATCHED

The latched input conditioning helps in stable signal processing and prevents signal loss, enhancing the reliability of the product.

No. of Bits: 8

Having 8 bits allows for complex data processing, making the product suitable for applications that require handling multiple data inputs.

Nominal Supply Voltage / Vsup (V): 4.5

Operating at a moderate supply voltage of 4.5V ensures compatibility with a wide range of systems and reduces the risk of voltage-related issues.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand elevated temperatures, making it suitable for applications in challenging thermal environments.

Technical Specifications

Decoder & Drivers CD54HC237F3A attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

ADDRESS LATCHES; 3 ENABLE INPUTS

Family:

HC/UH

Input Conditioning:

LATCHED

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

36 ns

Propagation Delay (tpd):

240 ns

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

5.08 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

CD54HC237F3A Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-330-5557, 5962013305557, 5962-01-341-1565, 5962013411565

NIIN

013305557, 013411565

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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