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CD54HC238F3A

Texas Instruments

CD54HC238F3A by Texas Instruments

CD54HC238F3A by Texas Instruments is an 8-bit decoder with 30ns propagation delay, suitable for military applications. It operates at a voltage range of 2-6V and has a max power supply current of 0.16mA. With a ceramic package and through-hole terminals, it offers reliable performance in harsh environments.

Median Price

$16.270

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 1 parts In-Stock

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Arrow

USA . 21 parts In-Stock

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$21.287

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$20.206

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$20.033

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Rochester

USA . 1 parts In-Stock

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$16.270

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$14.560

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$13.700

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$13.700

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Ace Electronics

USA . 5 parts In-Stock

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$8.920

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Digiode

USA . 1,410 parts In-Stock

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Vyrian

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Zilex Electronics Inc.

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North Shore Components

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PC Components Company LLC

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Bristol Electronics

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Resion

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Mil-Aero Solutions, Inc.

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Cyclops Electronics Ltd

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Native Components

USA . 636 parts In-Stock

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$1.787

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Northwest PG Solutions

USA . 578 parts In-Stock

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$1.966

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Corphita

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$13.716

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Parana Technologies

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$25.437

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$26.068

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DigiPath Technology Company

USA . 144 parts In-Stock

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$28.009

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$25.769

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ChromeModa Solutions

Germany . 687 parts In-Stock

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$28.581

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$23.436

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IDEA Electronic Components Group

UK . 612 parts In-Stock

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$28.581

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$27.152

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Lixinc

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Microchip USA

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A-Plus Industry Inc.

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Overview

Discover the unparalleled quality and reliability of Texas Instruments with the CD54HC238F3A decoder & drivers. This versatile product offers fast propagation delay, precise input conditioning, and a wide operating temperature range, making it ideal for a variety of applications. From industrial automation to telecommunications, this component delivers exceptional performance and value to customers seeking superior electronic solutions. Trust Texas Instruments to provide cutting-edge technology that exceeds expectations every time.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package body material ensures durability and reliability in various operating conditions.

Propagation Delay At Nominal Supply: 30 ns

With a low propagation delay at nominal supply, this product offers fast response times for decoding and driving signals.

Input Conditioning: STANDARD

Standard input conditioning simplifies the integration of this decoder and driver into existing circuit designs.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V makes this product compatible with a wide range of applications.

No. of Bits: 8

With 8 bits, this decoder and driver provides sufficient resolution for decoding and driving various signals.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance in harsh environmental conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

Technical Specifications

Decoder & Drivers CD54HC238F3A attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

TWO ACTIVE LOW AND ONE ACTIVE HIGH ENABLE INPUTS

Family:

HC/UH

Input Conditioning:

STANDARD

JESD-30 Code:

R-GDIP-T16

JESD-609 Code:

e0

Length:

19.56 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

5.2 Amp

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/6

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

30 ns

Propagation Delay (tpd):

225 ns

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

5.08 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

CD54HC238F3A Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-265-8186, 5962012658186

NIIN

012658186

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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