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CD74AC138M

Texas Instruments

CD74AC138M by Texas Instruments

CD74AC138M by Texas Instruments is an 8-bit decoder with a propagation delay of 15.4 ns at 3.3V, ideal for military-grade applications. It features inverted output polarity, operates b/w -55 to 125°C, and has a max supply voltage of 5.5V. This small outline package with gull wing terminals is suitable for surface mount designs requiring fast signal decoding.

Median Price

$0.584

Lifecycle Status

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32

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1k+

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Farnell

UK . 2,000 parts In-Stock

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Adafruit Industries

USA . 60 parts In-Stock

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Mouser Electronics

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Digiode

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Nova Conductors

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Bristol Electronics

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Semicontronic

India . 92 parts In-Stock

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$0.496

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$0.484

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$0.481

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Corphita

USA . 963 parts In-Stock

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Continental Prestige Electronics

USA . 5,870 parts In-Stock

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Argo Parts USA

USA . 19 parts In-Stock

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$0.566

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Advanced Electronics

New Zealand . 60 parts In-Stock

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Microchip USA

USA . 218 parts In-Stock

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AZTECH Wire

Italy . 529 parts In-Stock

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Corohmni

South Africa . 334 parts In-Stock

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Parana Technologies

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DigiPath Technology Company

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ChromeModa Solutions

Germany . 5,194 parts In-Stock

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IDEA Electronic Components Group

UK . 392 parts In-Stock

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Component Stockers USA

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Speed Components Ltd (Excess)

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Computer Components Inc. - USA

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Overview

Texas Instruments, a renowned leader in semiconductor manufacturing, presents the CD74AC138M decoder & driver. With a compact small outline package and inverted output polarity, this versatile component is ideal for military-grade applications. Offering fast propagation delay and low power consumption, it ensures optimal performance in various electronic systems. Trust Texas Instruments for top-notch quality and reliability, making the CD74AC138M a valuable choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability for the product, making it suitable for various applications.

Propagation Delay At Nominal Supply: 15.4 ns

Low propagation delay ensures fast response times, making it ideal for applications requiring quick signal processing.

No. of Bits: 8

Having 8 bits allows for complex decoding and driving tasks, making the product versatile for different projects.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at 3.3V is common and widely compatible with other components, simplifying the integration process.

Maximum Operating Temperature: 125 °C

High operating temperature range ensures reliability in various environmental conditions, making it suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, improving the overall efficiency and performance of the product.

Technical Specifications

Decoder & Drivers CD74AC138M attributes and parameters. Explore more Decoder & Drivers devices from Texas Instruments

Specs

Additional Features:

TWO ACTIVE-LOW AND ONE ACTIVE-HIGH ENABLE INPUTS

Family:

AC

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

24 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Maximum Power Supply Current (ICC):

.16 mA

Propagation Delay At Nominal Supply:

15.4 ns

Propagation Delay (tpd):

138 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.9 mm

Trade Compliance

CD74AC138M Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-14-500-0602, 5962145000602

NIIN

145000602

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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