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CD4512BD

Texas Instruments

CD4512BD by Texas Instruments

CD4512BD by Texas Instruments is a 8-input Multiplexer & Demultiplexer with 360 ns Propagation Delay. It operates b/w -55 to 125 °C and supports True Output Polarity. Ideal for military applications, it has a supply voltage range of 3-18 V and comes in an In-Line package style.

Median Price

$2.587

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 266 parts In-Stock

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-

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$2.320

1k+ parts

$2.070

10k+ parts

$1.950

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$1.950

DigiKey

USA . 266 parts In-Stock

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-

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$3.050

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$3.050

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Verical

USA . 266 parts In-Stock

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$2.587

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$2.438

266

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$2.438

Distributors (In-Stock)

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Digiode

USA . 2,165 parts In-Stock

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$2.460

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$2.460

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American Microsemiconductor Inc.

USA . 1 parts In-Stock

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$29.150

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Vyrian

USA . 3,297 parts In-Stock

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MISTER SPROCKETS

USA . 2 parts In-Stock

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Native Components

USA . 721 parts In-Stock

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$0.059

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$0.057

721

$0.059

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$0.057

Corphita

USA . 1,883 parts In-Stock

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$2.331

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$2.331

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Parana Technologies

USA . 2,038 parts In-Stock

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$9.980

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$10.544

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$9.980

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$10.544

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DigiPath Technology Company

USA . 2,247 parts In-Stock

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$10.990

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$10.990

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ChromeModa Solutions

Germany . 5,291 parts In-Stock

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$11.214

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$9.195

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IDEA Electronic Components Group

UK . 1,626 parts In-Stock

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$11.214

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$10.653

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$10.093

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1,626

$11.214

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$10.093

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QUARKTWIN TECHNOLOGY LTD

USA . 22,577 parts In-Stock

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Northwest PG Solutions

USA . 2,094 parts In-Stock

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Supply Digital

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Assy Fe

Spain . 25 parts In-Stock

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Overview

Discover the superior quality and reliability of the CD4512BD by Texas Instruments, a leading manufacturer in the industry. This multiplexer & demultiplexer is perfect for a wide range of applications, offering customers unmatched value and benefits. With its advanced technology and military-grade temperature grade, this product ensures optimal performance in any environment. Trust Texas Instruments to provide you with the best solutions for your needs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and reliability, making the product suitable for tough operating environments.

No. of Inputs: 8

Having 8 inputs allows for versatile connectivity and signal routing options, increasing the product's flexibility.

Propagation Delay (tpd): 360 ns

The low propagation delay ensures quick and efficient signal processing, making the product ideal for time-sensitive applications.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows the product to withstand extreme heat conditions, increasing its reliability.

Output Characteristics: 3-STATE

The 3-state output allows for high impedance when not actively transmitting, reducing signal interference and enhancing overall performance.

Technical Specifications

Multiplexer & Demultiplexer CD4512BD attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-CDIP-T16

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Propagation Delay (tpd):

360 ns

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Position:

DUAL

Trade Compliance

CD4512BD Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-093-2705, 5962010932705, 5962-01-077-8809, 5962010778809

NIIN

010932705, 010778809

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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