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CD4512BME4

Texas Instruments

CD4512BME4 by Texas Instruments

CD4512BME4 by Texas Instruments is a CMOS multiplexer/demultiplexer with 8 inputs, 3-STATE output, and propagation delay of 360 ns at 5V. It operates in a temperature range of -55 to 125°C and supports supply voltages from 3V to 18V. Ideal for military-grade applications requiring high-speed signal routing in compact spaces.

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1k+

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Vyrian

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Digiode

USA . 597 parts In-Stock

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Parana Technologies

USA . 1,829 parts In-Stock

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$9.950

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$10.514

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DigiPath Technology Company

USA . 298 parts In-Stock

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$10.956

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ChromeModa Solutions

Germany . 6,796 parts In-Stock

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$11.180

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$9.168

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IDEA Electronic Components Group

UK . 494 parts In-Stock

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$10.621

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$10.062

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AZTECH Wire

Italy . 804 parts In-Stock

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One Stop Electronics

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Corphita

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Northwest PG Solutions

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Overview

Looking for a reliable Multiplexer & Demultiplexer for your electronic projects? Look no further than the CD4512BME4 by Texas Instruments. With a reputable manufacturer like Texas Instruments, you can trust in the quality and durability of this product. Perfect for a variety of applications, this versatile component offers a propagation delay of 360 ns, 3-STATE output characteristics, and a small outline package style. Get your hands on the CD4512BME4 today and experience the value and benefits that Texas Instruments brings to the table!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components of the multiplexer/demultiplexer.

Propagation Delay At Nominal Supply: 360 ns

The low propagation delay ensures fast operation and efficient signal processing in the multiplexer/demultiplexer.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into electronic circuits and saves space on the PCB.

No. of Inputs: 8

Having 8 inputs allows for versatile input options and flexibility in signal routing.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes the product compatible with standard electronic systems and power sources.

Load Capacitance (CL): 50 pF

The specified load capacitance helps in determining the appropriate load that can be connected to the multiplexer/demultiplexer without affecting its performance.

Power Supplies (V): 5/15

Supporting multiple power supply options (5V and 15V) adds versatility to the product's application in different electronic setups.

No. of Terminals: 16

Having 16 terminals provides ample connection points for interfacing with other components and devices in a circuit.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature indicates robust performance even in harsh environmental conditions.

Output Characteristics: 3-STATE

The 3-state output feature allows for high impedance output state, providing flexibility in signal routing and processing.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures reliable operation even in extreme cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The use of nickel palladium gold finish on terminals enhances conductivity and ensures long-term reliability of connections.

Maximum Seated Height: 1.75 mm

The compact size with a maximum seated height of 1.75mm contributes to space-saving and efficient PCB design.

Width: 3.9 mm

The narrow width of 3.9mm enables easy integration of the multiplexer/demultiplexer in compact electronic devices.

Output Polarity: TRUE

Having true output polarity ensures accurate signal processing and consistent output results.

Minimum Supply Voltage (Vsup): 3 V

The ability to operate at a minimum supply voltage of 3V allows for compatibility with low-power electronic systems.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30s at peak temperature, the product can endure soldering processes without degradation.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260°C ensures reliability during soldering and assembly processes.

Length: 9.9 mm

The compact length of 9.9mm contributes to overall space efficiency in electronic circuit layouts.

Temperature Grade: MILITARY

The military-grade temperature rating ensures the product's performance and reliability in extreme temperature conditions.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form: GULL WING

Gull wing terminal form provides secure and reliable solder connections for stable circuit operation.

Packing Method: TUBE

The tube packing method ensures convenient storage, handling, and protection of the multiplexer/demultiplexer during transportation and assembly.

Terminal Pitch: 1.27 mm

The specified terminal pitch of 1.27mm facilitates easy soldering and connection with standard PCB layouts.

Maximum Supply Voltage (Vsup): 18 V

Supporting a maximum supply voltage of 18V allows for compatibility with a wide range of electronic systems and power sources.

Technical Specifications

Multiplexer & Demultiplexer CD4512BME4 attributes and parameters. Explore more Multiplexer & Demultiplexer devices from Texas Instruments

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TUBE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

360 ns

Propagation Delay (tpd):

360 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

CD4512BME4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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