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CC430F6135IRGCT

Texas Instruments

CC430F6135IRGCT by Texas Instruments

CC430F6135IRGCT by Texas Instruments is a telecom interface IC with 1 function. It has a package style of chip carrier and very thin profile, with a max seated height of 1mm. This industrial-grade IC operates at temperatures ranging from -40 to 85°C and has a nominal voltage of 2.2V.

Median Price

$4.436

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 739 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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739

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Distributors (In-Stock)

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Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$3.096

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$3.096

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Digiode

USA . 4,899 parts In-Stock

1+ parts

$5.776

100+ parts

-

1k+ parts

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4,899

$5.776

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Vyrian

USA . 5,473 parts In-Stock

1+ parts

-

100+ parts

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5,473

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 100 parts In-Stock

1+ parts

$3.096

100+ parts

$3.034

1k+ parts

-

10k+ parts

-

100

$3.096

$3.034

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-

Ampacity Inc.

Singapore . 686 parts In-Stock

1+ parts

$5.170

100+ parts

-

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686

$5.170

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Corphita

USA . 1,193 parts In-Stock

1+ parts

$5.472

100+ parts

-

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1,193

$5.472

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Parana Technologies

USA . 281 parts In-Stock

1+ parts

$12.578

100+ parts

-

1k+ parts

$13.031

10k+ parts

-

281

$12.578

-

$13.031

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DigiPath Technology Company

USA . 1,062 parts In-Stock

1+ parts

$13.850

100+ parts

$12.742

1k+ parts

-

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1,062

$13.850

$12.742

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ChromeModa Solutions

Germany . 6,679 parts In-Stock

1+ parts

$14.133

100+ parts

$11.589

1k+ parts

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6,679

$14.133

$11.589

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IDEA Electronic Components Group

UK . 604 parts In-Stock

1+ parts

$14.133

100+ parts

$13.426

1k+ parts

$12.720

10k+ parts

-

604

$14.133

$13.426

$12.720

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AZTECH Wire

Italy . 862 parts In-Stock

1+ parts

$17.433

100+ parts

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862

$17.433

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Overview

Discover the CC430F6135IRGCT by Texas Instruments, a high-quality telecom interface IC that offers exceptional benefits and advantages for customers. With its durable plastic/epoxy package body material and surface mount capabilities, this IC is designed to deliver reliable performance in a compact square shape. The CC430F6135IRGCT boasts a wide range of applications in the telecom industry, making it an ideal choice for various circuit needs. Experience the value of this product with its industrial temperature grade, no lead terminal form, and maximum seated height of just 1 mm. Trust Texas Instruments for innovative solutions that provide superior quality and unrivaled performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and strong protection, making this product suitable for various industrial applications.

Surface Mount: YES

The surface mount feature allows for easy installation and PCB integration, enabling efficient production and space-saving design.

No. of Functions: 1

With a single function integrated into the IC, this product offers simplicity and cost-effectiveness while still providing the necessary telecom interface capabilities.

Package Shape: SQUARE

The square package shape provides versatility in mounting and ensures compatibility with different device layouts and designs.

No. of Terminals: 64

With 64 terminals available, this telecom IC allows for multiple connections and supports complex circuitry, offering flexibility and expanded functionality.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The chip carrier package style with a very thin profile facilitates efficient heat dissipation, reducing the risk of overheating and enhancing overall performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature value allows this product to withstand demanding environmental conditions, ensuring reliable operation even in harsh settings.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature value enables this telecom IC to perform flawlessly in extremely cold environments, making it suitable for various industries and regions.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The use of nickel palladium, gold, and silver terminal finish enhances conductivity, improving signal transmission and minimizing signal degradation for optimal performance.

Terminal Position: QUAD

The quad terminal position provides a stable and secure connection, minimizing the risk of signal loss or disruption, and ensuring efficient telecom functionality.

Maximum Seated Height: 1 mm

With a maximum seated height of just 1 mm, this IC offers a compact form factor, allowing for efficient space utilization and streamlined device designs.

Width: 9 mm

The product's width of 9 mm enables compatibility with industry-standard sizes, making it easily integrated into various telecom systems and devices.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and optimal product performance during the assembly process.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this product can withstand high-temperature soldering processes, ensuring reliable and durable connections.

Length: 9 mm

The length of 9 mm allows for easy integration into existing telecom systems while providing adequate space for multiple functions and connections.

Temperature Grade: INDUSTRIAL

The industrial temperature grade indicates the product's capability to operate efficiently in industrial environments with wider temperature ranges, ensuring reliable performance and longevity.

Terminal Form: NO LEAD

The lead-free terminal form makes this product environmentally friendly, complying with modern regulations and promoting sustainability.

Telecom IC Type: TELECOM CIRCUIT

As a telecom circuit IC, this product is specifically designed and optimized to meet the requirements and demands of telecom applications, making it an excellent choice for such purposes.

Nominal Supply Voltage: 2.2 V

With a nominal supply voltage of 2.2 V, this product offers compatibility with standard power supply systems while reducing power consumption, promoting energy efficiency.

Terminal Pitch: 0.5 mm

The terminal pitch of 0.5 mm ensures precise and reliable connections, supporting high-speed signal transmission and maintaining data integrity.

Moisture Sensitivity Level (MSL): 3

The moisture sensitivity level of 3 ensures proper handling and storage of the product, minimizing the risk of moisture-related damage and guaranteeing performance reliability.

Technical Specifications

Other Function Telecom Interface ICs CC430F6135IRGCT attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Texas Instruments

Specs

JESD-30 Code:

S-PQCC-N64

JESD-609 Code:

e4

Length:

9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

2.2 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

9 mm

Trade Compliance

CC430F6135IRGCT Telecommunications trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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