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BQ27510DRZT-G2

Texas Instruments

BQ27510DRZT-G2 by Texas Instruments

BQ27510DRZT-G2 by Texas Instruments is a Power Management IC with 12 terminals, operating b/w -40 to 85°C. It has a supply voltage range of 2.7V to 5.5V and features an adjustable threshold for power supply support circuits. This IC is ideal for industrial applications requiring precise power management in compact spaces.

Median Price

$4.220

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 50 parts In-Stock

1+ parts

$4.220

100+ parts

$4.140

1k+ parts

$4.050

10k+ parts

-

50

$4.220

$4.140

$4.050

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$5.809

100+ parts

-

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50

$5.809

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Chip Stock

USA . 7,550 parts In-Stock

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7,550

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Vyrian

USA . 7,267 parts In-Stock

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7,267

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VNN

France . 5,199 parts In-Stock

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5,199

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Digiode

USA . 3,477 parts In-Stock

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3,477

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Bristol Electronics

USA . 250 parts In-Stock

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250

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Distributors (Availability)

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One Stop Electronics

USA . 1,109 parts In-Stock

1+ parts

$0.500

100+ parts

-

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1,109

$0.500

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Ampacity Inc.

Singapore . 143 parts In-Stock

1+ parts

$2.500

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-

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143

$2.500

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Continental Prestige Electronics

USA . 924 parts In-Stock

1+ parts

$5.809

100+ parts

-

1k+ parts

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10k+ parts

$5.693

924

$5.809

-

-

$5.693

Netroflash

USA . 100 parts In-Stock

1+ parts

$5.809

100+ parts

$5.693

1k+ parts

-

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100

$5.809

$5.693

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Parana Technologies

USA . 2,315 parts In-Stock

1+ parts

$17.437

100+ parts

-

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$17.639

10k+ parts

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2,315

$17.437

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$17.639

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AZTECH Wire

Italy . 736 parts In-Stock

1+ parts

$18.844

100+ parts

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736

$18.844

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DigiPath Technology Company

USA . 1,017 parts In-Stock

1+ parts

$19.200

100+ parts

$17.664

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1,017

$19.200

$17.664

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ChromeModa Solutions

Germany . 4,841 parts In-Stock

1+ parts

$19.592

100+ parts

$16.065

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4,841

$19.592

$16.065

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IDEA Electronic Components Group

UK . 2,007 parts In-Stock

1+ parts

$19.592

100+ parts

$18.612

1k+ parts

$17.633

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2,007

$19.592

$18.612

$17.633

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Lixinc

USA . 14,869 parts In-Stock

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14,869

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Futuretech Components

Singapore . 7,500 parts In-Stock

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7,500

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Perfect Parts

USA . 5,425 parts In-Stock

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5,425

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Argo Parts USA

USA . 2,736 parts In-Stock

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2,736

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Corphita

USA . 2,562 parts In-Stock

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2,562

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A-Z Elektronik GmbH

Germany . 500 parts In-Stock

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500

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Overview

Enhance your power management solutions with the BQ27510DRZT-G2 by Texas Instruments. Renowned for its superior quality and reliability, Texas Instruments delivers cutting-edge Power Management ICs like no other. This small outline, heat sink package offers versatile applications in various industries, providing customers with a highly efficient and cost-effective solution. With features such as an adjustable threshold and a wide supply voltage range, this product ensures optimal performance and flexibility for your power supply support circuit needs. Trust Texas Instruments to deliver exceptional value and innovation for all your power management requirements.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body provides durability and impact resistance, making the product suitable for various environments.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly onto circuit boards, saving time and effort during production.

Nominal Supply Voltage (Vsup): 3.6 V

The nominal supply voltage of 3.6V ensures compatibility with a wide range of devices and applications, providing reliable power management.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the product can withstand elevated temperatures without compromising performance.

Minimum Operating Temperature: -40 °C

The product's ability to operate at low temperatures down to -40°C ensures reliable performance in cold environments.

Width (mm): 2.5 mm

The small width of 2.5mm allows for compact and space-efficient designs, ideal for applications where size is a critical factor.

Minimum Supply Voltage (Vsup): 2.7 V

The minimum supply voltage of 2.7V ensures flexibility in powering the device, accommodating lower voltage sources for efficient power management.

Maximum Seated Height: 1 mm

The low maximum seated height of 1mm enables slim and sleek product designs, reducing the overall profile of the device.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures reliable operation in harsh industrial environments, making the product suitable for a wide range of applications.

Moisture Sensitivity Level (MSL): 2

The MSL rating of 2 indicates the product's resistance to moisture, ensuring long-term reliability and performance in humid conditions.

Technical Specifications

Power Management ICs BQ27510DRZT-G2 attributes and parameters. Explore more Power Management ICs devices from Texas Instruments

Specs

Adjustable Threshold:

YES

JESD-30 Code:

R-PDSO-N12

JESD-609 Code:

e4

Length:

4 mm

Moisture Sensitivity Level (MSL):

2

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.7 V

Nominal Supply Voltage (Vsup):

3.6 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

2.5 mm

Trade Compliance

BQ27510DRZT-G2 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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