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AM2432BSDGGIALXR

Texas Instruments

AM2432BSDGGIALXR by Texas Instruments

Texas Instruments' AM2432BSDGGIALXR microcontroller features Cortex-R5F CPU, 16-bit external data bus, and 8-channel 10-bit ADC. Ideal for applications requiring high-speed processing, multiple timers, and various connectivity options like CAN, I2C, SPI.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,385 parts In-Stock

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Vyrian

USA . 3,961 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 373 parts In-Stock

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$2.000

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373

$2.000

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AZTECH Wire

Italy . 860 parts In-Stock

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$9.958

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860

$9.958

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Parana Technologies

USA . 2,309 parts In-Stock

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$25.945

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$26.540

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2,309

$25.945

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$26.540

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ChromeModa Solutions

Germany . 3,968 parts In-Stock

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$29.152

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$23.905

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3,968

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$23.905

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IDEA Electronic Components Group

UK . 2,317 parts In-Stock

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$29.152

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$27.694

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$26.237

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2,317

$29.152

$27.694

$26.237

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Ampacity Inc.

Singapore . 877 parts In-Stock

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$33.000

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877

$33.000

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Semicontronic

India . 278 parts In-Stock

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$33.000

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$32.175

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$32.010

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278

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$32.010

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DigiPath Technology Company

USA . 1,878 parts In-Stock

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$26.283

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$26.283

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Native Components

USA . 706 parts In-Stock

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Northwest PG Solutions

USA . 463 parts In-Stock

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Corphita

USA . 316 parts In-Stock

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Corohmni

South Africa . 123 parts In-Stock

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Overview

Unleash the power of innovation with the AM2432BSDGGIALXR by Texas Instruments. This cutting-edge microcontroller offers unparalleled quality and reliability, backed by the renowned manufacturer's expertise in the field. Ideal for a wide range of applications, this versatile product provides customers with exceptional value, benefits, and advantages. Elevate your projects to new heights with the AM2432BSDGGIALXR and experience the difference that top-tier technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, making it suitable for a variety of environments.

Integrated Cache: YES

Integrated cache helps improve processing speed and efficiency, enhancing overall performance of the microcontroller.

Maximum Supply Voltage: 0.895 V

With a maximum supply voltage of 0.895 V, this microcontroller offers energy-efficient operation.

On Chip Data RAM Width: 8

Having a wider width of on-chip data RAM allows for faster data transfer and processing capabilities.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C enables this microcontroller to be used in harsh or high-temperature environments.

ADC Channels: YES

The presence of ADC channels allows the microcontroller to convert analog signals to digital data, enabling a wide range of sensing and measurement applications.

Peripherals: CAP(3), DMA(5), POR, PWM(7), QEP(3), RTI, TIMER(16), WWDT(4)

A variety of peripherals such as capacitors, DMA channels, PWM channels, and timers allows for versatile functionality and customization options for different applications.

Connectivity: CAN(2), I2C(3), SD, SPI(7), UART(8)

Multiple connectivity options including CAN, I2C, SPI, and UART enable easy communication and integration with other devices and systems.

ROM Programmability: MROM

MROM programmability ensures secure and reliable code storage, offering protection against accidental erasure or modification.

Technical Specifications

Microcontrollers AM2432BSDGGIALXR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

14

Boundary Scan:

YES

CPU Family:

CORTEX-R5F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B293

Length:

11 mm

Low Power Mode:

YES

No. of DMA Channels:

5

No. of External Interrupts:

1

No. of I/O Lines:

148

No. of Serial I/Os:

7

No. of Terminals:

293

No. of Timers:

16

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA293,21X21,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

2048000

ROM Programmability:

MROM

Maximum Seated Height:

1 mm

Speed:

800 rpm

Maximum Supply Voltage:

.895 V

Minimum Supply Voltage:

.81 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

11 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(3), SD, SPI(7), UART(8)

Peripherals:

CAP(3), DMA(5), POR, PWM(7), QEP(3), RTI, TIMER(16), WWDT(4)

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

AM2432BSDGGIALXR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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