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AM2431BSDGHIALVR

Texas Instruments

AM2431BSDGHIALVR by Texas Instruments

AM2431BSDGHIALVR by Texas Instruments is a microcontroller with 32-bit external data bus width, 23-bit address bus width, and 8-channel 12-bit ADC. It is suitable for applications requiring high-speed processing, such as industrial automation systems and automotive control units. With features like integrated cache and low power mode, it offers efficient performance in a compact package.

Median Price

$24.480

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 6,276 parts In-Stock

1+ parts

$14.799

100+ parts

$12.927

1k+ parts

$8.915

10k+ parts

-

6,276

$14.799

$12.927

$8.915

-

DigiKey

USA . 210 parts In-Stock

1+ parts

$24.480

100+ parts

$17.254

1k+ parts

-

10k+ parts

-

210

$24.480

$17.254

-

-

Mouser Electronics

USA . 273 parts In-Stock

1+ parts

$25.920

100+ parts

$17.730

1k+ parts

$15.340

10k+ parts

-

273

$25.920

$17.730

$15.340

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 523 parts In-Stock

1+ parts

$14.059

100+ parts

-

1k+ parts

-

10k+ parts

-

523

$14.059

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$15.500

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$15.500

-

-

-

VNN

France . 23,927 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

23,927

-

-

-

-

Bristol Electronics

USA . 6,987 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,987

-

-

-

-

Vyrian

USA . 4,083 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,083

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 2,265 parts In-Stock

1+ parts

$12.580

100+ parts

-

1k+ parts

-

10k+ parts

-

2,265

$12.580

-

-

-

Corphita

USA . 2,719 parts In-Stock

1+ parts

$13.319

100+ parts

-

1k+ parts

-

10k+ parts

-

2,719

$13.319

-

-

-

Continental Prestige Electronics

USA . 2,137 parts In-Stock

1+ parts

$14.219

100+ parts

-

1k+ parts

-

10k+ parts

$13.935

2,137

$14.219

-

-

$13.935

Parana Technologies

USA . 2,264 parts In-Stock

1+ parts

$27.256

100+ parts

$2,531.156

1k+ parts

$24.531

10k+ parts

-

2,264

$27.256

$2,531.156

$24.531

-

DigiPath Technology Company

USA . 2,222 parts In-Stock

1+ parts

$30.012

100+ parts

$27.612

1k+ parts

-

10k+ parts

-

2,222

$30.012

$27.612

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-

ChromeModa Solutions

Germany . 3,450 parts In-Stock

1+ parts

$30.625

100+ parts

$25.112

1k+ parts

-

10k+ parts

-

3,450

$30.625

$25.112

-

-

IDEA Electronic Components Group

UK . 16 parts In-Stock

1+ parts

$30.625

100+ parts

$29.094

1k+ parts

$27.562

10k+ parts

-

16

$30.625

$29.094

$27.562

-

Microchip USA

USA . 1,945 parts In-Stock

1+ parts

$31.200

100+ parts

$30.760

1k+ parts

$30.530

10k+ parts

$30.310

1,945

$31.200

$30.760

$30.530

$30.310

Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$15.190

1k+ parts

$14.725

10k+ parts

$14.415

1,000

-

$15.190

$14.725

$14.415

Argo Parts USA

USA . 262 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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262

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-

Overview

Elevate your projects with the AM2431BSDGHIALVR microcontroller by Texas Instruments. Known for their superior quality and innovation, Texas Instruments delivers cutting-edge technology in a compact package. Perfect for a wide range of applications, this microcontroller offers unmatched value, benefits, and advantages to customers. From its integrated cache to its low power mode, the AM2431BSDGHIALVR is designed to enhance performance and efficiency. Upgrade your projects today with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and thermal stability of the package, making it suitable for a wide range of applications.

Integrated Cache: YES

Having integrated cache improves the overall performance of the microcontroller by reducing the access time to frequently used data and instructions.

Maximum Supply Voltage: 0.895 V

The low maximum supply voltage helps in reducing power consumption and heat dissipation, making it energy efficient.

On Chip Data RAM Width: 8

A wider data RAM width allows for faster data processing and storage capabilities on the chip itself.

Address Bus Width: 23

A wider address bus width enables access to a larger memory space, which is beneficial for complex applications requiring more memory.

No. of Terminals: 441

Having a high number of terminals provides more options for connectivity and interfacing with external devices or peripherals.

ADC Channels: YES

The presence of Analog to Digital Convertor (ADC) channels allows for conversion of analog signals to digital data, enabling the microcontroller to interface with various sensors and external analog devices.

DMA Channels: YES

Direct Memory Access (DMA) channels help in efficient data transfer between peripherals and memory without CPU intervention, improving overall performance and reducing latency.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency enables the microcontroller to execute instructions at a faster rate, making it suitable for applications requiring real-time processing.

Peripherals: DMA(5), POR, PWM(9), RTI, TIMER(16), WDT(4)

A wide range of peripherals such as DMA, PWM, timers, and watchdog timers enhance the microcontroller's functionality and versatility for different applications.

Analog To Digital Convertors: 8-Ch 12-Bit

Having multiple ADC channels with 12-bit resolution provides accurate conversion of analog signals, making the microcontroller suitable for applications requiring precise analog measurements.

Connectivity: CAN(2), I2C(6), SPI(7), UART(9), USB

Multiple connectivity options such as CAN, I2C, SPI, UART, and USB facilitate communication with various external devices, expanding the microcontroller's compatibility and flexibility.

Technical Specifications

Microcontrollers AM2431BSDGHIALVR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

23

Boundary Scan:

YES

CPU Family:

CORTEX-R5F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B441

Length:

17.2 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

5

No. of External Interrupts:

1

No. of I/O Lines:

198

No. of Serial I/Os:

11

No. of Terminals:

441

No. of Timers:

16

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA441,21X21,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Peak Reflow Temperature (C):

250

RAM Bytes:

2048000

ROM Words:

0

ROM Programmability:

MROM

Maximum Seated Height:

2.652 mm

Speed:

800 rpm

Maximum Supply Voltage:

.895 V

Minimum Supply Voltage:

.81 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

17.2 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(6), SPI(7), UART(9), USB

Peripherals:

DMA(5), POR, PWM(9), RTI, TIMER(16), WDT(4)

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

AM2431BSDGHIALVR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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