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AM2431BSDGGIALXR

Texas Instruments

AM2431BSDGGIALXR by Texas Instruments

Texas Instruments AM2431BSDGGIALXR microcontroller features Cortex-R5F CPU, 16 timers, 8 ADC channels, and 2048000 bytes of RAM. With CAN, I2C, SPI connectivity options and low power mode support, it's ideal for applications requiring high-speed processing and multiple peripherals in a compact form factor.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,336 parts In-Stock

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Digiode

USA . 3,201 parts In-Stock

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3,201

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Distributors (Availability)

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Northwest PG Solutions

USA . 2,068 parts In-Stock

1+ parts

$3.422

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2,068

$3.422

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One Stop Electronics

USA . 858 parts In-Stock

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$5.000

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858

$5.000

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Semicontronic

India . 460 parts In-Stock

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$13.000

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$12.675

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$12.610

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460

$13.000

$12.675

$12.610

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Parana Technologies

USA . 645 parts In-Stock

1+ parts

$15.593

100+ parts

$1,448.028

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$14.034

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645

$15.593

$1,448.028

$14.034

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DigiPath Technology Company

USA . 988 parts In-Stock

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$17.170

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988

$17.170

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ChromeModa Solutions

Germany . 5,183 parts In-Stock

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$17.520

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$14.366

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$17.520

$14.366

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IDEA Electronic Components Group

UK . 1,844 parts In-Stock

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$17.520

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$16.644

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$15.768

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1,844

$17.520

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$15.768

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AZTECH Wire

Italy . 289 parts In-Stock

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$19.075

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Corphita

USA . 2,664 parts In-Stock

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Native Components

USA . 763 parts In-Stock

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$3.017

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Corohmni

South Africa . 479 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the AM2431BSDGGIALXR by Texas Instruments. Crafted with precision and expertise, this microcontroller offers unparalleled performance and reliability. Perfect for a wide range of applications, it provides seamless connectivity and exceptional speed, giving you the edge you need to stay ahead. Experience the quality and innovation that only Texas Instruments can deliver, and elevate your projects to new heights with the AM2431BSDGGIALXR. Discover the possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the microcontroller lightweight and cost-effective.

Integrated Cache: YES

The integrated cache helps in improving the performance of the microcontroller by reducing memory access times.

Maximum Supply Voltage: 0.895 V

This low maximum supply voltage helps in reducing power consumption and heat generation.

Address Bus Width: 14

The 14-bit address bus width allows for accessing a larger memory space, enhancing the versatility of the microcontroller.

No. of Terminals: 293

Having a large number of terminals provides flexibility in connecting external devices and peripherals.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this microcontroller can withstand harsh environments and high temperature conditions.

ADC Channels: YES

The analog-to-digital converter channels enable the microcontroller to interface with analog sensors and devices.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller ensures efficient and fast processing of instructions, making it suitable for real-time applications.

RAM Bytes: 2048000

With a large RAM capacity, this microcontroller can handle complex computations and store a significant amount of data.

Connectivity: CAN(2), I2C(3), SD, SPI(7), UART(8)

The multiple connectivity options allow the microcontroller to communicate with a variety of devices and networks, enhancing its versatility.

Technical Specifications

Microcontrollers AM2431BSDGGIALXR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

14

Boundary Scan:

YES

CPU Family:

CORTEX-R5F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B293

Length:

11 mm

Low Power Mode:

YES

No. of DMA Channels:

5

No. of External Interrupts:

1

No. of I/O Lines:

148

No. of Serial I/Os:

7

No. of Terminals:

293

No. of Timers:

16

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA293,21X21,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

2048000

ROM Programmability:

MROM

Maximum Seated Height:

1 mm

Speed:

800 rpm

Maximum Supply Voltage:

.895 V

Minimum Supply Voltage:

.81 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

11 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(3), SD, SPI(7), UART(8)

Peripherals:

CAP(3), DMA(5), POR, PWM(7), QEP(3), RTI, TIMER(16), WWDT(4)

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

AM2431BSDGGIALXR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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