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AM2432BKEGGIALXR

Texas Instruments

AM2432BKEGGIALXR by Texas Instruments

Texas Instruments AM2432BKEGGIALXR microcontroller features Cortex-R5F CPU, 16 timers, 8 ADC channels, and 16-bit external data bus. With a max clock frequency of 25 MHz and low power mode, it's ideal for applications requiring high-speed processing and energy efficiency in industrial automation and automotive systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,926 parts In-Stock

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VNN

France . 4,580 parts In-Stock

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4,580

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Digiode

USA . 2,508 parts In-Stock

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Nova Conductors

Japan . 35 parts In-Stock

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AZTECH Wire

Italy . 527 parts In-Stock

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$17.945

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527

$17.945

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One Stop Electronics

USA . 1,566 parts In-Stock

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$27.000

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Ampacity Inc.

Singapore . 609 parts In-Stock

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$29.000

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$29.000

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Corohmni

South Africa . 333 parts In-Stock

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$54.133

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333

$54.133

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Parana Technologies

USA . 852 parts In-Stock

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$68.914

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DigiPath Technology Company

USA . 737 parts In-Stock

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$75.882

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737

$75.882

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ChromeModa Solutions

Germany . 3,229 parts In-Stock

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$77.431

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$63.493

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IDEA Electronic Components Group

UK . 2,234 parts In-Stock

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$77.431

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$73.559

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$69.688

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$69.688

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Corphita

USA . 4,203 parts In-Stock

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Continental Prestige Electronics

USA . 2,580 parts In-Stock

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Argo Parts USA

USA . 2,215 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Overview

Experience unmatched performance and reliability with the AM2432BKEGGIALXR microcontroller from Texas Instruments. As a leader in the industry, Texas Instruments delivers cutting-edge technology that ensures superior quality and functionality. This microcontroller's applications are limitless, offering solutions for a wide range of projects. From its integrated cache to its low power mode, this product provides customers with exceptional value and benefits. Trust Texas Instruments to provide you with the tools you need to bring your ideas to life.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the microcontroller, ensuring a longer lifespan.

Maximum Supply Voltage: 0.895 V

Allows for efficient power management and operation within specified voltage limits.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Enables compact and space-saving design, making it suitable for applications with limited space.

CPU Family: CORTEX-R5F

The Cortex-R5F family offers high performance and reliability, making it ideal for robust applications.

Maximum Clock Frequency: 25 MHz

Provides fast processing speed for handling complex tasks efficiently.

Analog To Digital Convertors: 8-Ch 10-Bit

Allows for precise analog signal conversion, essential for various sensing and measurement applications.

Connectivity: CAN(2), I2C(3), SD, SPI(7), UART(8)

Offers versatile connectivity options for interfacing with external devices and networks, enhancing the microcontroller's functionality.

Low Power Mode: YES

Enables energy-efficient operation, prolonging the device's battery life and reducing power consumption.

Technical Specifications

Microcontrollers AM2432BKEGGIALXR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

14

Boundary Scan:

YES

CPU Family:

CORTEX-R5F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B293

Length:

11 mm

Low Power Mode:

YES

No. of DMA Channels:

5

No. of External Interrupts:

1

No. of I/O Lines:

148

No. of Serial I/Os:

7

No. of Terminals:

293

No. of Timers:

16

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA293,21X21,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

RAM Bytes:

2048000

ROM Programmability:

MROM

Maximum Seated Height:

1 mm

Speed:

800 rpm

Maximum Supply Voltage:

.895 V

Minimum Supply Voltage:

.81 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

11 mm

Peripheral IC Type:

Connectivity:

CAN(2), I2C(3), SD, SPI(7), UART(8)

Peripherals:

CAP(3), DMA(5), POR, PWM(7), QEP(3), RTI, TIMER(16), WWDT(4)

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

AM2432BKEGGIALXR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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