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AM2432BSDGHIALV

Texas Instruments

AM2432BSDGHIALV by Texas Instruments

AM2432BSDGHIALV by Texas Instruments is a microcontroller with 23-bit address bus, 32-bit external data bus, and 8-channel ADC. It is ideal for applications requiring high-speed processing, such as industrial automation and automotive control systems. With features like integrated cache and low power mode, it offers efficient performance in a compact package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,641 parts In-Stock

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Digiode

USA . 3,283 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 182 parts In-Stock

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$1.000

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$1.000

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AZTECH Wire

Italy . 658 parts In-Stock

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$5.072

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658

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One Stop Electronics

USA . 1,256 parts In-Stock

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$12.000

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$12.000

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Semicontronic

India . 208 parts In-Stock

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$31.000

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$30.225

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$30.070

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208

$31.000

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$30.070

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Microchip USA

USA . 452 parts In-Stock

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$53.540

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$52.610

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$52.150

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$51.680

452

$53.540

$52.610

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$51.680

Corphita

USA . 1,905 parts In-Stock

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Northwest PG Solutions

USA . 1,248 parts In-Stock

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Native Components

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Corohmni

South Africa . 381 parts In-Stock

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Overview

Elevate your projects to the next level with the AM2432BSDGHIALV by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-quality microcontrollers that offer unparalleled performance and reliability. Ideal for a wide range of applications, this microcontroller is packed with features like integrated cache, ADC channels, and low power mode. With its advanced technology and innovative design, the AM2432BSDGHIALV provides value, efficiency, and versatility to customers looking to create cutting-edge solutions. Experience the difference with Texas Instruments microcontrollers today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides good durability and resistance to external factors, making the product reliable for long-term use.

Integrated Cache: YES

Having integrated cache helps in improving the processing speed and efficiency of the microcontroller by reducing access time to frequently used data.

Maximum Supply Voltage: 0.895 V

High maximum supply voltage allows for flexibility in power supply options and compatibility with a wide range of systems.

On Chip Data RAM Width: 8

Having a wider on-chip data RAM width allows for faster data processing and storage capabilities within the microcontroller.

Address Bus Width: 23

A wider address bus width enables the microcontroller to access a larger memory space and handle more complex data processing tasks efficiently.

No. of Terminals: 441

Having a large number of terminals provides ample connectivity options for interfacing with various external devices and peripherals.

Maximum Operating Temperature: 125 °C

High maximum operating temperature range ensures the microcontroller can perform reliably in harsh environmental conditions without overheating.

No. of Timers: 16

Having multiple timers allows for precise timing control and scheduling of tasks, making the microcontroller suitable for applications requiring time-sensitive operations.

RAM Bytes: 2048000

Large RAM capacity enables efficient storage and retrieval of data during program execution, enhancing the performance and functionality of the microcontroller.

Analog To Digital Convertors: 8-Ch 12-Bit

Multiple ADC channels with high resolution enable accurate conversion of analog signals to digital data, making the microcontroller versatile for sensor interfacing and data acquisition applications.

Technical Specifications

Microcontrollers AM2432BSDGHIALV attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

23

Boundary Scan:

YES

CPU Family:

CORTEX-R5F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B441

Length:

17.2 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

5

No. of External Interrupts:

1

No. of I/O Lines:

198

No. of Serial I/Os:

11

No. of Terminals:

441

No. of Timers:

16

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA441,21X21,32

Package Shape:

Package Style (Meter):

GRID ARRAY, HEAT SINK/SLUG, FINE PITCH

Peak Reflow Temperature (C):

250

RAM Bytes:

2048000

ROM Words:

0

ROM Programmability:

MROM

Maximum Seated Height:

2.652 mm

Speed:

800 rpm

Maximum Supply Voltage:

.895 V

Minimum Supply Voltage:

.81 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

17.2 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(6), SPI(7), UART(9), USB

Peripherals:

DMA(5), POR, PWM(9), RTI, TIMER(16), WDT(4)

Analog To Digital Convertors:

8-Ch 12-Bit

Trade Compliance

AM2432BSDGHIALV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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