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AM2432BSDGHIALXR

Texas Instruments

AM2432BSDGHIALXR by Texas Instruments

Texas Instruments AM2432BSDGHIALXR microcontroller features Cortex-R5F CPU, 32-bit external data bus, and 16 timers. Ideal for applications requiring CAN, I2C, SPI, UART, and USB connectivity with low power mode support. Package style: grid array with 293 terminals in a square shape.

Median Price

$16.776

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 854 parts In-Stock

1+ parts

$12.533

100+ parts

$10.948

1k+ parts

$7.550

10k+ parts

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854

$12.533

$10.948

$7.550

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Mouser Electronics

USA . 976 parts In-Stock

1+ parts

$21.020

100+ parts

$14.560

1k+ parts

$12.880

10k+ parts

-

976

$21.020

$14.560

$12.880

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DigiKey

USA . 868 parts In-Stock

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868

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Digiode

USA . 3,452 parts In-Stock

1+ parts

$11.906

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3,452

$11.906

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Vyrian

USA . 2,862 parts In-Stock

1+ parts

$12.533

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2,862

$12.533

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 612 parts In-Stock

1+ parts

$10.650

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612

$10.650

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Semicontronic

India . 465 parts In-Stock

1+ parts

$10.650

100+ parts

$10.384

1k+ parts

$10.330

10k+ parts

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465

$10.650

$10.384

$10.330

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Corphita

USA . 197 parts In-Stock

1+ parts

$11.280

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197

$11.280

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Corohmni

South Africa . 480 parts In-Stock

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$12.533

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480

$12.533

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Microchip USA

USA . 3,088 parts In-Stock

1+ parts

$29.600

100+ parts

$29.170

1k+ parts

$28.960

10k+ parts

$28.750

3,088

$29.600

$29.170

$28.960

$28.750

Northwest PG Solutions

USA . 1,579 parts In-Stock

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Native Components

USA . 533 parts In-Stock

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533

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Overview

Elevate your electronics projects with the AM2432BSDGHIALXR by Texas Instruments, a high-quality microcontroller that offers unparalleled performance and reliability. Designed by industry leader Texas Instruments, this microcontroller boasts integrated cache, advanced peripherals, and low power modes, making it ideal for a wide range of applications. From embedded systems to IoT devices, this microcontroller delivers exceptional value and benefits to customers looking for cutting-edge technology. Upgrade your designs with the AM2432BSDGHIALXR and experience innovation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the microcontroller, ensuring long-term reliability.

Integrated Cache: YES

Improves processing speed and efficiency by storing frequently accessed data close to the CPU.

Maximum Supply Voltage: 0.895 V

Allows for versatile power options while still maintaining safe operating levels.

On Chip Data RAM Width: 8

Offers efficient data storage capabilities for faster computations and multitasking.

Address Bus Width: 23

Enables the microcontroller to access a large memory space, suitable for handling complex applications.

No. of Terminals: 293

Provides ample connectivity options for external components and peripherals.

Maximum Clock Frequency: 25 MHz

Supports high-speed processing for demanding tasks and real-time applications.

ADC Channels: YES

Allows for analog signal conversion, making the microcontroller suitable for sensor interfacing and data acquisition.

DMA Channels: YES

Facilitates efficient data transfer between peripherals and memory, enhancing overall system performance.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a power-efficient RISC architecture for optimized performance and low power consumption.

Technical Specifications

Microcontrollers AM2432BSDGHIALXR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

23

Boundary Scan:

YES

CPU Family:

CORTEX-R5F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B293

Length:

11 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

5

No. of External Interrupts:

1

No. of I/O Lines:

148

No. of Serial I/Os:

9

No. of Terminals:

293

No. of Timers:

16

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA293,21X21,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

250

RAM Bytes:

2048000

ROM Words:

0

ROM Programmability:

MROM

Maximum Seated Height:

1 mm

Speed:

800 rpm

Maximum Supply Voltage:

.895 V

Minimum Supply Voltage:

.81 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

11 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(3), SPI(4), UART(7), USB

Peripherals:

DMA(5), POR, PWM(7), RTI, TIMER(16), WDT(4)

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

AM2432BSDGHIALXR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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