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AM2434BSDGHIALXR

Texas Instruments

AM2434BSDGHIALXR by Texas Instruments

Texas Instruments AM2434BSDGHIALXR microcontroller features 32-bit external data bus, 8 ADC channels, and 16 timers. Ideal for applications requiring high-speed processing with a max clock frequency of 25 MHz. Suitable for use in systems needing low power mode and connectivity options like CAN, I2C, SPI, UART, and USB.

Median Price

$20.592

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 4,228 parts In-Stock

1+ parts

$14.973

100+ parts

$13.079

1k+ parts

$9.020

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4,228

$14.973

$13.079

$9.020

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Mouser Electronics

USA . 995 parts In-Stock

1+ parts

$26.210

100+ parts

$17.510

1k+ parts

$16.150

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-

995

$26.210

$17.510

$16.150

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DigiKey

USA . 1,000 parts In-Stock

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1,000

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Digiode

USA . 630 parts In-Stock

1+ parts

$14.224

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630

$14.224

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VNN

France . 3,167 parts In-Stock

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3,167

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Vyrian

USA . 1,698 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 587 parts In-Stock

1+ parts

$0.979

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587

$0.979

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Ampacity Inc.

Singapore . 1,652 parts In-Stock

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$12.730

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$12.730

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Corphita

USA . 4,956 parts In-Stock

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$13.476

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$13.476

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Microchip USA

USA . 2,373 parts In-Stock

1+ parts

$35.360

100+ parts

$34.850

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$34.600

10k+ parts

$34.350

2,373

$35.360

$34.850

$34.600

$34.350

Continental Prestige Electronics

USA . 5,957 parts In-Stock

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Argo Parts USA

USA . 4,424 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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Overview

Enhance your electronic designs with the AM2434BSDGHIALXR microcontroller by Texas Instruments. As a leader in the industry, Texas Instruments guarantees top-notch quality and reliability. This microcontroller is perfect for a wide range of applications, offering advanced features and high performance. With integrated cache and a wide array of peripherals, this product provides exceptional value and flexibility to customers. Trust Texas Instruments to deliver cutting-edge technology that will elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that provides protection to the internal components

Integrated Cache: YES

Enhances the processing speed and efficiency of the microcontroller

Maximum Supply Voltage: 0.895 V

Allows for safe operation within specified voltage limits

On Chip Data RAM Width: 8

Provides sufficient memory storage for data processing

Peripherals: DMA(5), POR, PWM(7), RTI, TIMER(16), WDT(4)

Offers a wide range of peripheral options for versatile applications

ADC Channels: YES

Enables analog to digital conversion for sensor interfacing

Maximum Clock Frequency: 25 MHz

High clock frequency for faster operation and real-time processing

Connectivity: CAN(2), I2C(3), SPI(4), UART(7), USB

Supports various communication protocols for versatile connectivity options

ROM Programmability: MROM

Allows for non-volatile program storage with minimal power consumption

Low Power Mode: YES

Efficient power management feature for energy-saving applications

Technical Specifications

Microcontrollers AM2434BSDGHIALXR attributes and parameters. Explore more Microcontrollers devices from Texas Instruments

Specs

ADC Channels:

YES

Address Bus Width:

23

Boundary Scan:

YES

CPU Family:

CORTEX-R5F

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

32

Format:

FLOATING-POINT

Integrated Cache:

YES

JESD-30 Code:

S-PBGA-B293

Length:

11 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

3

No. of DMA Channels:

5

No. of External Interrupts:

1

No. of I/O Lines:

148

No. of Serial I/Os:

9

No. of Terminals:

293

No. of Timers:

16

On Chip Data RAM Width:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA293,21X21,20

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

250

RAM Bytes:

2048000

ROM Words:

0

ROM Programmability:

MROM

Maximum Seated Height:

1 mm

Speed:

800 rpm

Maximum Supply Voltage:

.895 V

Minimum Supply Voltage:

.81 V

Nominal Supply Voltage:

.85 V

Surface Mount:

YES

Technology:

CMOS

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

BOTTOM

Width:

11 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(3), SPI(4), UART(7), USB

Peripherals:

DMA(5), POR, PWM(7), RTI, TIMER(16), WDT(4)

Analog To Digital Convertors:

8-Ch 10-Bit

Trade Compliance

AM2434BSDGHIALXR Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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