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74GTLP22034DGGRE4

Texas Instruments

74GTLP22034DGGRE4 by Texas Instruments

74GTLP22034DGGRE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 7.1 ns at 3.3V, suitable for GTLP & LVTTL translation applications. It features open-drain/3-state output characteristics, operates b/w -40 to 85 °C, and has a max power supply current of 40 mA.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,432 parts In-Stock

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Digiode

USA . 896 parts In-Stock

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AZTECH Wire

Italy . 530 parts In-Stock

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$4.979

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530

$4.979

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Parana Technologies

USA . 2,364 parts In-Stock

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$14.524

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$14.963

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2,364

$14.524

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$14.963

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DigiPath Technology Company

USA . 1,442 parts In-Stock

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$15.993

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$14.713

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$14.713

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IDEA Electronic Components Group

UK . 2,058 parts In-Stock

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$16.319

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$15.503

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$14.687

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2,058

$16.319

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$14.687

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ChromeModa Solutions

Germany . 1,470 parts In-Stock

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$16.319

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$13.382

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$16.319

$13.382

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One Stop Electronics

USA . 704 parts In-Stock

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$58.000

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704

$58.000

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Andel Nordic

Denmark . 473 parts In-Stock

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$79.833

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$76.639

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$76.639

473

$79.833

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$76.639

Component Stockers USA

USA . 670 parts In-Stock

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$99.990

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$99.990

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Corphita

USA . 3,251 parts In-Stock

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Northwest PG Solutions

USA . 939 parts In-Stock

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Native Components

USA . 669 parts In-Stock

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Microchip USA

USA . 401 parts In-Stock

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Overview

Discover the power of seamless data transmission with the 74GTLP22034DGGRE4 by Texas Instruments. Crafted with precision and expertise, this bus driver & transceiver offers unrivaled performance and reliability. Ideal for a wide range of applications, this product guarantees fast propagation delay and efficient translation between GTLP & LVTTL signals. With a compact design and industrial-grade temperature tolerance, this device ensures top-notch quality without compromising on functionality. Elevate your projects with the Texas Instruments 74GTLP22034DGGRE4 and experience unparalleled value like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 7.1 ns

Low propagation delay allows for fast signal transmission, making this product suitable for high-speed bus communication.

Surface Mount: YES

Enables easy and convenient installation on PCBs, saving space and making the product suitable for compact designs.

Translation: GTLP & LVTTL

Support for multiple translation standards allows compatibility with various systems, increasing the product's versatility.

Nominal Supply Voltage / Vsup (V): 3.3

Operates at a common voltage level, making it compatible with many other components in the system.

Output Characteristics: OPEN-DRAIN/3-STATE

Offers flexibility in output options, allowing the device to work in various configurations and modes as per the application requirements.

Maximum Operating Temperature: 85 °C

Can withstand high temperatures, suitable for industrial environments where temperature fluctuations are common.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable in operation.

Technical Specifications

Bus Driver & Transceivers 74GTLP22034DGGRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

AO OUTPUTS HAVE EQUIVALENT 26-OHM SERIES RESISTORS

Control Type:

INDEPENDENT CONTROL

Count Direction:

BIDIRECTIONAL

Family:

GTLP

JESD-30 Code:

R-PDSO-G48

Length:

12.5 mm

Maximum I (ol):

100 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN/3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3.3

Maximum Power Supply Current (ICC):

40 mA

Propagation Delay At Nominal Supply:

7.1 ns

Propagation Delay (tpd):

8.6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

3.45 V

Minimum Supply Voltage (Vsup):

3.15 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Translation:

GTLP & LVTTL

Trigger Type:

POSITIVE EDGE

Width:

6.1 mm

Trade Compliance

74GTLP22034DGGRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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