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74ABTR2245DGVRE4

Texas Instruments

74ABTR2245DGVRE4 by Texas Instruments

74ABTR2245DGVRE4 by Texas Instruments is an 8-bit bus driver with a propagation delay of 4.5 ns, suitable for industrial applications. It operates at a supply voltage range of 4.5V to 5.5V and features a small outline package with dual terminals and Gull Wing form factor, making it ideal for compact designs requiring fast signal transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,059 parts In-Stock

1+ parts

-

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5,059

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Digiode

USA . 4,746 parts In-Stock

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4,746

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 516 parts In-Stock

1+ parts

$7.350

100+ parts

-

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516

$7.350

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Parana Technologies

USA . 1,262 parts In-Stock

1+ parts

$22.255

100+ parts

-

1k+ parts

$22.926

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1,262

$22.255

-

$22.926

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Native Components

USA . 298 parts In-Stock

1+ parts

$22.825

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-

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298

$22.825

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DigiPath Technology Company

USA . 1,024 parts In-Stock

1+ parts

$24.506

100+ parts

$22.545

1k+ parts

-

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1,024

$24.506

$22.545

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ChromeModa Solutions

Germany . 1,862 parts In-Stock

1+ parts

$25.006

100+ parts

$20.505

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1,862

$25.006

$20.505

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IDEA Electronic Components Group

UK . 1,812 parts In-Stock

1+ parts

$25.006

100+ parts

$23.756

1k+ parts

$22.505

10k+ parts

-

1,812

$25.006

$23.756

$22.505

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Northwest PG Solutions

USA . 777 parts In-Stock

1+ parts

$25.107

100+ parts

$22.597

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777

$25.107

$22.597

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One Stop Electronics

USA . 149 parts In-Stock

1+ parts

$38.000

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149

$38.000

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Andel Nordic

Denmark . 46 parts In-Stock

1+ parts

$45.908

100+ parts

-

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$44.072

10k+ parts

$44.072

46

$45.908

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$44.072

$44.072

Corphita

USA . 2,593 parts In-Stock

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2,593

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Microchip USA

USA . 321 parts In-Stock

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321

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Overview

Enhance your electronic designs with the 74ABTR2245DGVRE4 by Texas Instruments, a high-quality bus driver & transceiver that delivers reliable performance. Texas Instruments, known for its top-notch products, ensures that this device meets industry standards and exceeds expectations. Ideal for a variety of applications, this compact and efficient component offers customers value by providing fast propagation delay, low power consumption, and versatile terminal options. Upgrade your projects with the trusted brand and advanced technology of Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer product life.

Surface Mount: YES

Allows for easy and secure mounting on a PCB, saving space and making assembly more efficient.

No. of Bits: 8

Provides a sufficient number of bits for data transmission and communication in bus driver applications.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard voltage level, ensuring compatibility with common power sources.

Propagation Delay (tpd): 4.5 ns

Offers fast signal propagation, enabling quick data transmission and response times.

Temperature Grade: INDUSTRIAL

Suitable for use in industrial environments with varying temperature conditions, ensuring reliability and performance.

Technical Specifications

Bus Driver & Transceivers 74ABTR2245DGVRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH DIRECTION CONTROL

Family:

ABT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE WITH SERIES RESISTOR

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25,16

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Maximum Power Supply Current (ICC):

32 mA

Propagation Delay (tpd):

4.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74ABTR2245DGVRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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