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74ABTH16823DGGRE4

Texas Instruments

74ABTH16823DGGRE4 by Texas Instruments

74ABTH16823DGGRE4 by Texas Instruments is a Bus Driver & Transceiver with 9 bits, 6.8 ns propagation delay, and 3-STATE output characteristics. It operates at a supply voltage of 5V and has a max frequency of 150MHz. Ideal for industrial applications requiring fast signal transmission in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,969 parts In-Stock

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3,969

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Digiode

USA . 472 parts In-Stock

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472

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Distributors (Availability)

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Parana Technologies

USA . 200 parts In-Stock

1+ parts

$11.946

100+ parts

$1,109.328

1k+ parts

$10.751

10k+ parts

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200

$11.946

$1,109.328

$10.751

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DigiPath Technology Company

USA . 2,231 parts In-Stock

1+ parts

$13.154

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2,231

$13.154

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ChromeModa Solutions

Germany . 5,235 parts In-Stock

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$13.422

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$11.006

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5,235

$13.422

$11.006

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IDEA Electronic Components Group

UK . 2,300 parts In-Stock

1+ parts

$13.422

100+ parts

$12.751

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$12.080

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2,300

$13.422

$12.751

$12.080

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AZTECH Wire

Italy . 376 parts In-Stock

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$16.951

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376

$16.951

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Andel Nordic

Denmark . 64 parts In-Stock

1+ parts

$37.590

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$36.086

10k+ parts

$36.086

64

$37.590

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$36.086

$36.086

One Stop Electronics

USA . 223 parts In-Stock

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$59.000

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223

$59.000

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Corphita

USA . 1,875 parts In-Stock

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1,875

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Northwest PG Solutions

USA . 1,592 parts In-Stock

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Native Components

USA . 488 parts In-Stock

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Microchip USA

USA . 362 parts In-Stock

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362

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Overview

Elevate your electronic designs with the 74ABTH16823DGGRE4 by Texas Instruments, a top-tier manufacturer known for quality and innovation in bus driver & transceivers. This versatile component offers fast propagation delay, low power consumption, and high performance, making it ideal for a wide range of applications. Experience seamless signal transmission, reliable operation, and enhanced functionality with this cutting-edge product. Upgrade your projects with the best in the industry and unlock new possibilities with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to environmental factors, ensuring a longer lifespan for the product.

Propagation Delay At Nominal Supply: 6.8 ns

Low propagation delay ensures fast and efficient communication between components, making this product ideal for high-speed applications.

Surface Mount: YES

Surface mount capability allows for easy installation and integration into electronic circuits, saving time and effort during assembly.

No. of Functions: 2

This product offers multiple functions in a single package, reducing the need for additional components and simplifying the design of electronic systems.

Nominal Supply Voltage / Vsup (V): 5

Operates at a standard 5V supply voltage, making it compatible with a wide range of electronic devices and systems.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of board space and easy placement on circuit boards, optimizing the layout of the overall electronic system.

No. of Bits: 9

Having 9 bits allows for higher precision and accuracy in data transmission, making this product suitable for applications that require complex communication protocols.

Technical Specifications

Bus Driver & Transceivers 74ABTH16823DGGRE4 attributes and parameters. Explore more Bus Driver & Transceivers devices from Texas Instruments

Specs

Additional Features:

WITH CLEAR AND CLOCK ENABLE

Family:

ABT

JESD-30 Code:

R-PDSO-G56

Length:

14 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

150000000 Hz

Maximum I (ol):

64 Amp

No. of Bits:

9

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

56

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP56,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

80 mA

Propagation Delay At Nominal Supply:

6.8 ns

Propagation Delay (tpd):

6 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

BICMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trigger Type:

POSITIVE EDGE

Width:

6.1 mm

Trade Compliance

74ABTH16823DGGRE4 Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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