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5962-9065001PX

Texas Instruments

5962-9065001PX by Texas Instruments

The Texas Instruments 5962-9065001PX is a MIL-STD-883 compliant analog circuit IC with 8 terminals in an in-line package. It operates b/w -55°C to 125°C, with a supply voltage of 6V. This glass-sealed ceramic component is commonly used in military-grade applications requiring precise functionality and durability.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,825 parts In-Stock

1+ parts

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8,825

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Digiode

USA . 3,635 parts In-Stock

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3,635

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,327 parts In-Stock

1+ parts

$0.500

100+ parts

-

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1,327

$0.500

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One Stop Electronics

USA . 948 parts In-Stock

1+ parts

$3.500

100+ parts

-

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948

$3.500

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Semicontronic

India . 1,100 parts In-Stock

1+ parts

$7.500

100+ parts

$7.312

1k+ parts

$7.275

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-

1,100

$7.500

$7.312

$7.275

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AZTECH Wire

Italy . 564 parts In-Stock

1+ parts

$11.871

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564

$11.871

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Native Components

USA . 220 parts In-Stock

1+ parts

$12.480

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220

$12.480

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Northwest PG Solutions

USA . 2,363 parts In-Stock

1+ parts

$13.728

100+ parts

$12.355

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-

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2,363

$13.728

$12.355

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Parana Technologies

USA . 494 parts In-Stock

1+ parts

$14.104

100+ parts

-

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$14.569

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494

$14.104

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$14.569

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DigiPath Technology Company

USA . 1,780 parts In-Stock

1+ parts

$15.530

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1,780

$15.530

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ChromeModa Solutions

Germany . 2,460 parts In-Stock

1+ parts

$15.847

100+ parts

$12.995

1k+ parts

-

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2,460

$15.847

$12.995

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IDEA Electronic Components Group

UK . 1,344 parts In-Stock

1+ parts

$15.847

100+ parts

$15.055

1k+ parts

$14.262

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1,344

$15.847

$15.055

$14.262

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Corphita

USA . 798 parts In-Stock

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798

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Corohmni

South Africa . 170 parts In-Stock

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170

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Overview

Elevate your electronic designs with the 5962-9065001PX by Texas Instruments. Crafted with precision and expertise, this semiconductor offers superior quality and reliability for a wide range of applications. Whether you're working on military-grade projects or complex analog circuits, this product delivers exceptional performance in extreme temperatures. Unlock endless possibilities with the Texas Instruments 5962-9065001PX - where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

Provides durability and protection, ensuring the product can withstand harsh environments.

Screening Level: MIL-STD-883

Ensures high reliability and quality standards, making it suitable for critical applications.

Nominal Supply Voltage (Vsup): 6 V

Offers a stable voltage supply for consistent performance.

Maximum Operating Temperature: 125 °C

Can operate in high-temperature conditions without compromising performance.

Minimum Operating Temperature: -55 °C

Capable of functioning in low-temperature environments.

Terminal Form: THROUGH-HOLE

Facilitates easy installation and maintenance of the product.

Temperature Grade: MILITARY

Meets stringent military standards, ensuring reliability in demanding applications.

Technical Specifications

Other Function Semiconductors 5962-9065001PX attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

R-GDIP-T8

Length:

9.58 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Shape:

Package Style (Meter):

IN-LINE

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

5.08 mm

Nominal Supply Voltage (Vsup):

6 V

Surface Mount:

NO

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width (mm):

7.62 mm

Trade Compliance

5962-9065001PX Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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