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5962-90650012X

Texas Instruments

5962-90650012X by Texas Instruments

5962-90650012X by Texas Instruments is a MIL-STD-883 compliant analog circuit IC in a square chip carrier package. With a nominal voltage of 6V, it operates b/w -55°C to 125°C. Featuring a ceramic, metal-sealed cofired body and quad terminal position, it is suitable for military-grade applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,607 parts In-Stock

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8,607

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Digiode

USA . 4,846 parts In-Stock

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4,846

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Distributors (Availability)

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Semicontronic

India . 1,244 parts In-Stock

1+ parts

$3.500

100+ parts

$3.412

1k+ parts

$3.395

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1,244

$3.500

$3.412

$3.395

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Ampacity Inc.

Singapore . 452 parts In-Stock

1+ parts

$3.500

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452

$3.500

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Parana Technologies

USA . 2,000 parts In-Stock

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$3.638

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$4.148

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2,000

$3.638

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$4.148

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DigiPath Technology Company

USA . 786 parts In-Stock

1+ parts

$4.006

100+ parts

$3.686

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786

$4.006

$3.686

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IDEA Electronic Components Group

UK . 1,292 parts In-Stock

1+ parts

$4.088

100+ parts

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$3.679

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1,292

$4.088

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$3.679

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ChromeModa Solutions

Germany . 45 parts In-Stock

1+ parts

$4.088

100+ parts

$3.352

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45

$4.088

$3.352

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One Stop Electronics

USA . 1,291 parts In-Stock

1+ parts

$5.500

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1,291

$5.500

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AZTECH Wire

Italy . 551 parts In-Stock

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$10.508

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551

$10.508

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Native Components

USA . 806 parts In-Stock

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$15.789

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806

$15.789

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Northwest PG Solutions

USA . 1,855 parts In-Stock

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$17.368

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$15.631

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1,855

$17.368

$15.631

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Corphita

USA . 4,653 parts In-Stock

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Corohmni

South Africa . 295 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the Texas Instruments 5962-90650012X. As a leader in semiconductor technology, Texas Instruments delivers exceptional products that exceed industry standards. This Analog Circuit chip carrier is ideal for military-grade applications, offering superior performance in extreme temperatures. With a ceramic, metal-sealed co-fired package body and surface mount capability, this component provides unmatched value and longevity for your projects. Trust Texas Instruments to deliver cutting-edge solutions for your most demanding applications.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material combination provides excellent durability and reliability, making this product suitable for harsh environments.

Surface Mount: YES

Being surface-mountable allows for easy and efficient manufacturing processes.

Screening Level: MIL-STD-883

This level of screening ensures high quality and reliability of the product, meeting strict military standards.

Nominal Supply Voltage (Vsup): 6 V

This specific voltage requirement makes it compatible with many applications and systems.

No. of Terminals: 20

Having a sufficient number of terminals allows for versatile connections and functionalities.

Package Style (Meter): CHIP CARRIER

The chip carrier style enhances thermal performance and efficiency of the product.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand elevated heat levels.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature ensures functionality even in extreme cold environments.

Terminal Position: QUAD

The quad terminal position enables efficient routing and connection of signals.

Maximum Seated Height: 2.54 mm

The low seated height allows for compact and space-saving designs.

Other IC type: ANALOG CIRCUIT

Being an analog circuit type, this product is suitable for processing continuous signals with high precision.

Temperature Grade: MILITARY

Designed for military-grade applications, ensuring reliability and performance in demanding scenarios.

Terminal Form: NO LEAD

The no-lead terminal form offers better soldering connections and is environmentally friendly.

Terminal Pitch: 1.27 mm

The precise terminal pitch allows for accurate and secure connections.

Technical Specifications

Other Function Semiconductors 5962-90650012X attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

2.54 mm

Nominal Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width (mm):

8.89 mm

Trade Compliance

5962-90650012X Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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