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5962-90650012A

Texas Instruments

5962-90650012A by Texas Instruments

5962-90650012A by Texas Instruments is a military-grade analog circuit IC with a nominal voltage of 6V and max output current of 0.25A. It features a ceramic, metal-sealed cofired package body material in a square chip carrier style, suitable for applications requiring high reliability in extreme temperatures from -55°C to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,489 parts In-Stock

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8,489

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Digiode

USA . 3,000 parts In-Stock

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3,000

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Distributors (Availability)

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Semicontronic

India . 1,050 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

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-

1,050

$1.500

$1.462

$1.455

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Ampacity Inc.

Singapore . 903 parts In-Stock

1+ parts

$1.500

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903

$1.500

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One Stop Electronics

USA . 1,639 parts In-Stock

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$4.500

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1,639

$4.500

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AZTECH Wire

Italy . 491 parts In-Stock

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$9.670

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491

$9.670

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Parana Technologies

USA . 1,806 parts In-Stock

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$10.095

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$10.644

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1,806

$10.095

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$10.644

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Native Components

USA . 788 parts In-Stock

1+ parts

$10.755

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788

$10.755

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ChromeModa Solutions

Germany . 315 parts In-Stock

1+ parts

$11.343

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$9.301

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315

$11.343

$9.301

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IDEA Electronic Components Group

UK . 85 parts In-Stock

1+ parts

$11.343

100+ parts

$10.776

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$10.209

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85

$11.343

$10.776

$10.209

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Northwest PG Solutions

USA . 1,355 parts In-Stock

1+ parts

$11.831

100+ parts

$10.647

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1,355

$11.831

$10.647

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Corphita

USA . 2,793 parts In-Stock

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2,793

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DigiPath Technology Company

USA . 1,119 parts In-Stock

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$10.227

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1,119

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$10.227

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Corohmni

South Africa . 441 parts In-Stock

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441

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Overview

Experience unparalleled quality and reliability with the 5962-90650012A by Texas Instruments. As a trusted manufacturer in the semiconductor industry, Texas Instruments delivers cutting-edge solutions for various applications. This versatile chip carrier offers exceptional value with its MIL-STD-883 screening level, military-grade temperature grade, and maximum output current of 0.25 A. Ideal for analog circuits, this ceramic, metal-sealed co-fired semiconductor boasts a nominal output voltage of 5 V and a wide operating temperature range. Trust Texas Instruments for top-notch performance and unmatched benefits in your next project.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent thermal conductivity and durability, ensuring the product can withstand high temperatures and harsh environments.

Surface Mount: YES

Being surface mountable makes installation easier and more convenient, especially in compact electronic designs.

Screening Level: MIL-STD-883

The adherence to military screening standards ensures high reliability and performance in critical applications.

Nominal Supply Voltage (Vsup): 6 V

The 6V supply voltage allows for compatibility with a wide range of systems and components.

Maximum Operating Temperature: 125 °C

The ability to operate at temperatures up to 125°C indicates the product's reliability and resilience in challenging conditions.

Technology: BIPOLAR

Bipolar technology offers high performance and stability in analog circuits, making this product suitable for precision applications.

Technical Specifications

Other Function Semiconductors 5962-90650012A attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-CQCC-N20

Length:

8.89 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Current:

.25 A

Nominal Output Voltage:

5 V

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

2.54 mm

Sub-Category:

Other Analog ICs

Nominal Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

8.89 mm

Trade Compliance

5962-90650012A Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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