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5962-90650022A

Texas Instruments

5962-90650022A by Texas Instruments

Texas Instruments 5962-90650022A is a MIL-STD-883 compliant analog circuit with a supply voltage of 6V, operating temperature range of -55 to 125 °C. It features a max output voltage of 35V and current of 0.25A, suitable for military-grade applications requiring high reliability and performance in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,343 parts In-Stock

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Digiode

USA . 661 parts In-Stock

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Semicontronic

India . 295 parts In-Stock

1+ parts

$1.500

100+ parts

$1.462

1k+ parts

$1.455

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295

$1.500

$1.462

$1.455

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One Stop Electronics

USA . 314 parts In-Stock

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$3.500

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314

$3.500

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AZTECH Wire

Italy . 798 parts In-Stock

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$4.914

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798

$4.914

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Ampacity Inc.

Singapore . 152 parts In-Stock

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$7.500

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$7.500

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Native Components

USA . 190 parts In-Stock

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$9.270

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190

$9.270

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Northwest PG Solutions

USA . 1,129 parts In-Stock

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$10.197

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$9.177

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$9.177

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Parana Technologies

USA . 330 parts In-Stock

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$20.246

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$20.237

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$20.246

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$20.237

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IDEA Electronic Components Group

UK . 1,755 parts In-Stock

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$22.748

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$21.611

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$20.473

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$22.748

$21.611

$20.473

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ChromeModa Solutions

Germany . 169 parts In-Stock

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$22.748

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$18.653

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$22.748

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Corphita

USA . 3,040 parts In-Stock

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DigiPath Technology Company

USA . 365 parts In-Stock

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$20.510

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Corohmni

South Africa . 91 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the 5962-90650022A by Texas Instruments. This high-quality semiconductor offers unmatched reliability and performance due to its MIL-STD-883 screening level and military-grade temperature grade. Ideal for a wide range of applications, this chip carrier package delivers a nominal supply voltage of 6V and a maximum output voltage of 35V, making it perfect for demanding analog circuit requirements. Trust Texas Instruments to provide innovative solutions that exceed expectations and add value to your projects. Upgrade to the 5962-90650022A today and experience the difference!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent durability and thermal conductivity, ensuring reliable performance even in harsh environments.

Surface Mount: YES

Allows for easy integration onto circuit boards, making installation and maintenance hassle-free.

Screening Level: MIL-STD-883

Meets stringent military standards for quality and reliability, ensuring consistent performance in demanding applications.

Nominal Supply Voltage (Vsup): 6 V

Ideal voltage level for efficient power consumption and optimal performance.

No. of Terminals: 20

Sufficient number of terminals for versatile connectivity options without additional components.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures without compromising performance, making it suitable for a wide range of applications.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and low noise, making it suitable for precision analog applications.

Technical Specifications

Other Function Semiconductors 5962-90650022A attributes and parameters. Explore more Other Function Semiconductors devices from Texas Instruments

Specs

Other IC type:

JESD-30 Code:

S-CQCC-N20

JESD-609 Code:

e0

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Maximum Output Current:

.25 A

Maximum Output Voltage:

35 V

Minimum Output Voltage:

2.5 V

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC20,.35SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Qualification:

Qualified

Screening Level:

MIL-STD-883

Sub-Category:

Other Analog ICs

Nominal Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

5962-90650022A Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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